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Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/033075
Kind Code:
A1
Abstract:
Provided is an adhesive composition having both high adhesive strength and improved cohesive failure rate. An adhesive composition that includes a thermosetting resin (component (A)), a toughening agent (component (B)), a curing agent and/or a curing accelerator (component (C), with the curing agent being component (C-1) and the curing accelerator being component (C-2)); and a cohesion failure rate-improving agent (component (D)). Component (B) includes a resin that has at least one type selected from the group consisting of a hydroxy group, a carboxy group, a carboxylic anhydride group, an amino group, an amide group, and a glycidyl group. The blending ratio for component (B) and component (D) is 3:1–1:3 by mass ratio. Components (A), (B), (C), and (D) fulfill conditions (I) and (II). Condition (I): The tensile strength of a measurement test piece prepared from a component (B) film and a cured product of a mixture of components (A) and (C) is at least 4 MPa and the strain energy per unit volume is at least 100 kJ/m3. Condition (II): The tensile strength of a measurement test piece prepared from a component (D) film and a cured product of a mixture of components (A) and (C) is no more than 3 MPa and the strain per unit volume is no more than 50 kJ/m3.

Inventors:
KAKUTAKA KAIRI (JP)
Application Number:
PCT/JP2022/032855
Publication Date:
March 09, 2023
Filing Date:
August 31, 2022
Export Citation:
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Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C09J201/00; B32B7/12; C09J11/06; C09J163/00
Domestic Patent References:
WO2015093281A12015-06-25
WO2020235588A12020-11-26
Foreign References:
JPH09241602A1997-09-16
JPS5682865A1981-07-06
JPH06313157A1994-11-08
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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