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Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, METHOD FOR MANUFACTURING SAME, CONNECTION STRUCTURE BODY, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/102672
Kind Code:
A1
Abstract:
A method of manufacturing an adhesive film for circuit connection, the method comprising: preparing a substrate having a plurality of recesses on a surface thereof and having conductive particles in at least a portion of the plurality of recesses; providing, on the surface of the substrate, a composition layer containing a photosetting component and a first thermosetting component to transfer the conductive particles to the composition layer; irradiating the composition layer with light to form a first adhesive layer containing the conductive particles, a cured product of the photosetting component, and the first thermosetting component; and providing, on one surface of the first adhesive layer, a second adhesive layer containing a second thermosetting component.

Inventors:
MORIYA TOSHIMITSU (JP)
AKAI KUNIHIKO (JP)
ICHIMURA TAKAYUKI (JP)
Application Number:
PCT/JP2021/041394
Publication Date:
May 19, 2022
Filing Date:
November 10, 2021
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
C09J4/02; C09J7/35; C09J9/02; C09J11/04; C09J11/06; C09J201/00; H01B5/16; H01R11/01; H01R43/00
Domestic Patent References:
WO2020184583A12020-09-17
WO2020004510A12020-01-02
Foreign References:
JP2015149127A2015-08-20
JP2010033793A2010-02-12
JP2014060150A2014-04-03
JP2016189334A2016-11-04
JP2016149393A2016-08-18
JP2016131082A2016-07-21
JP2013124330A2013-06-24
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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