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Patent Searching and Data


Title:
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE MANUFACTURE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/058429
Kind Code:
A1
Abstract:
The present invention relates to a manufacturing method of an adhesive film for semiconductor device manufacture. This manufacturing method involves, in the following order, (A) a step for preparing a laminate comprising at least a carrier film strip no more than 100 mm wide, and an adhesive layer formed so as to cover the surface of the carrier film, and (B) a step for die cutting the adhesive layer to obtain multiple adhesive pieces disposed on the carrier film and aligned in the longitudinal direction of the carrier film, wherein, when performing die-cutting in step (B), cuts are made in the adhesive layer and the carrier film so as to satisfy the condition represented by the inequality (1) below. (1) ... 0 < D/T ≤ 0.6 [In this expression, D is the depth (unit μm) of cut into the carrier film, and T is the thickness (unit μm) of the carrier film.]

Inventors:
OHKUBO KEISUKE (JP)
NATSUKAWA MASANORI (JP)
Application Number:
PCT/JP2017/033746
Publication Date:
March 28, 2019
Filing Date:
September 19, 2017
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B7/14; H01L21/52; B32B27/00; B32B38/04; C09J7/00; H01L21/683
Foreign References:
JP2010129632A2010-06-10
JPH11274244A1999-10-08
JP2002299389A2002-10-11
JPH1131702A1999-02-02
JP2006111727A2006-04-27
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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