ADHESIVE FILM FOR SEMICONDUCTOR DEVICE MANUFACTURE AND MANUFACTURING METHOD THEREOF

WIPO Patent Application WO/2019/058429

A1

The present invention relates to a manufacturing method of an adhesive film for semiconductor device manufacture. This manufacturing method involves, in the following order, (A) a step for preparing a laminate comprising at least a carrier film strip no more than 100 mm wide, and an adhesive layer formed so as to cover the surface of the carrier film, and (B) a step for die cutting the adhesive layer to obtain multiple adhesive pieces disposed on the carrier film and aligned in the longitudinal direction of the carrier film, wherein, when performing die-cutting in step (B), cuts are made in the adhesive layer and the carrier film so as to satisfy the condition represented by the inequality (1) below. (1) ... 0 < D/T ≤ 0.6 [In this expression, D is the depth (unit μm) of cut into the carrier film, and T is the thickness (unit μm) of the carrier film.]

JP2850896	[Title of Invention] A semiconductor chip bonding device and a method for manufacturing a semiconductor device.
JP2000154360	ADHESIVE, ADHESIVE MEMBER, WIRING BOARD EQUIPPED WITH THE ADHESIVE MEMBER FOR SEMICONDUCTOR, AND SEMICONDUCTOR EQUIPMENT
JPS5512730	SEMICONDUCTOR DEVICE

OHKUBO KEISUKE (JP)
NATSUKAWA MASANORI (JP)

PCT/JP2017/033746

March 28, 2019

September 19, 2017

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HITACHI CHEMICAL CO LTD (JP)

H01L21/52; B32B7/14; B32B27/00; B32B38/04; C09J7/00; H01L21/683

JP2010129632A	2010-06-10
JPH11274244A	1999-10-08
JP2002299389A	2002-10-11
JPH1131702A	1999-02-02
JP2006111727A	2006-04-27

HASEGAWA Yoshiki et al. (JP)

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