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Title:
ADHESIVE LAMINATED FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/235389
Kind Code:
A1
Abstract:
Provided is an adhesive laminated film (50) used to protect circuit-forming surfaces of electronic components, the adhesive laminated film (50) comprising a base layer (20), a concave-convex absorbent resin layer (30), and an adhesive resin layer (40) in this order, wherein the concave-convex absorbent resin layer (30) contains an ethylene-based copolymer having a melting point of 40-80°C and a crosslinking agent, and the content of the crosslinking agent in the concave-convex absorbent resin layer (30) is 0.06-0.60 parts by mass with respect to 100 parts by mass of the ethylene-based copolymer.

Inventors:
UNEZAKI Takashi (JP)
KAI Takashi (JP)
MUROFUSHI Takanobu (JP)
KINOSHITA Jin (JP)
Application Number:
PCT/JP2021/018599
Publication Date:
November 25, 2021
Filing Date:
May 17, 2021
Export Citation:
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Assignee:
MITSUI CHEMICALS TOHCELLO, INC. (JP)
International Classes:
B32B27/00; B32B27/26; B32B27/32; B32B27/36; H01L23/00; C09J201/00; C09J7/24; C09J7/29; C09J7/38
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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