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Patent Searching and Data


Title:
ADHESIVE MATERIAL REEL
Document Type and Number:
WIPO Patent Application WO2010110094
Kind Code:
A1
Abstract:
An adhesive material reel, provided with a circuit connecting tape which comprises a tape-shaped base material and an adhesive layer which is formed on one side of the base material; and a core around which the circuit connecting tape is to be wound. The above-mentioned circuit connecting tape has a portion where the adhesive layer is not formed, for a length of at least one roll of the core, starting from the terminus towards the starting end; and an end tape that is pasted together with the terminus portion of the circuit connecting tape so as to cover the portion where the adhesive layer is not formed, and which extends from the terminus portion towards the core.

Inventors:
TATSUZAWA TAKASHI (JP)
SEKI TAKASHI (JP)
KOBAYASHI KOUJI (JP)
FUJINAWA TOHRU (JP)
ARIFUKU MOTOHIRO (JP)
SEKI KOTARO (JP)
Application Number:
PCT/JP2010/054235
Publication Date:
September 30, 2010
Filing Date:
March 12, 2010
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
TATSUZAWA TAKASHI (JP)
SEKI TAKASHI (JP)
KOBAYASHI KOUJI (JP)
FUJINAWA TOHRU (JP)
ARIFUKU MOTOHIRO (JP)
SEKI KOTARO (JP)
International Classes:
H01R11/01; B65H75/28; C09J7/02; H01B5/16; H05K1/14; H05K3/32
Domestic Patent References:
WO2009044560A12009-04-09
WO1998044067A11998-10-08
Foreign References:
JP2006015621A2006-01-19
JP2005336447A2005-12-08
JP2001284005A2001-10-12
JP2003034468A2003-02-07
Other References:
See also references of EP 2312697A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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