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Patent Searching and Data


Title:
ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/071391
Kind Code:
A1
Abstract:
An adhesive for semiconductors, which contains (a) an inorganic filler, and which is configured such that the inorganic filler (a) contains 50% by mass or more of a surface-treated inorganic filler that has a glycidyl group based on the total amount of the inorganic filler (a).

Inventors:
TANIGUCHI TETSUYA (JP)
SATOU MAKOTO (JP)
CHABANA KOICHI (JP)
Application Number:
PCT/JP2019/038821
Publication Date:
April 09, 2020
Filing Date:
October 01, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L23/29; C09J11/04; C09J11/06; C09J163/00; H01L21/60; H01L23/31
Foreign References:
JP2017041499A2017-02-23
JP2013038175A2013-02-21
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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