Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/032888
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an adhesive which exhibits adhesive properties and heat resistance and is capable of transferring/mounting a large number of semiconductor elements all at once even in a step in which heat is applied to the semiconductor elements. This adhesive contains at least: (A) a polyimide copolymer having an acid dianhydride residue and a diamine residue; and (B) a dimer acid epoxy resin. The diamine residue has: a diamine residue (A1) which is represented by formula (1) and in which n is an integer of 1-15 (hereinafter referred to as diamine residue (A1)); a diamine residue (A2) which is represented by formula (1) and in which n is an integer of 16-50 (hereinafter referred to as diamine residue (A2)); and a diamine residue (A3) having a phenolic hydroxyl group (hereinafter referred to as diamine residue (A3)). Relative to a total of 100.0 mol% of all diamine residues in the polyimide copolymer (A), the content of the diamine residue (A1) is 50.0-95.0 mol%, the content of the diamine residue (A2) is 1.0-40.0 mol%, and the content of the diamine residue (A3) is 1.0-30.0 mol%.

Inventors:
ARIMOTO YUKARI (JP)
FUJIWARA TAKENORI (JP)
ARAKI HITOSHI (JP)
Application Number:
PCT/JP2022/032346
Publication Date:
March 09, 2023
Filing Date:
August 29, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C09J11/06; C09J163/00; C09J179/08; H01L21/60
Domestic Patent References:
WO2016021646A12016-02-11
Foreign References:
JP2012156473A2012-08-16
JP2020194089A2020-12-03
JP2017214472A2017-12-07
JPH11345843A1999-12-14
JP2017214501A2017-12-07
JP2006324547A2006-11-30
JP2021150614A2021-09-27
JP2019054120A2019-04-04
JP2006108556A2006-04-20
JP2015140372A2015-08-03
JP2020129638A2020-08-27
JPH10226778A1998-08-25
Download PDF: