Title:
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/032888
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an adhesive which exhibits adhesive properties and heat resistance and is capable of transferring/mounting a large number of semiconductor elements all at once even in a step in which heat is applied to the semiconductor elements. This adhesive contains at least: (A) a polyimide copolymer having an acid dianhydride residue and a diamine residue; and (B) a dimer acid epoxy resin. The diamine residue has: a diamine residue (A1) which is represented by formula (1) and in which n is an integer of 1-15 (hereinafter referred to as diamine residue (A1)); a diamine residue (A2) which is represented by formula (1) and in which n is an integer of 16-50 (hereinafter referred to as diamine residue (A2)); and a diamine residue (A3) having a phenolic hydroxyl group (hereinafter referred to as diamine residue (A3)). Relative to a total of 100.0 mol% of all diamine residues in the polyimide copolymer (A), the content of the diamine residue (A1) is 50.0-95.0 mol%, the content of the diamine residue (A2) is 1.0-40.0 mol%, and the content of the diamine residue (A3) is 1.0-30.0 mol%.
Inventors:
ARIMOTO YUKARI (JP)
FUJIWARA TAKENORI (JP)
ARAKI HITOSHI (JP)
FUJIWARA TAKENORI (JP)
ARAKI HITOSHI (JP)
Application Number:
PCT/JP2022/032346
Publication Date:
March 09, 2023
Filing Date:
August 29, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C09J11/06; C09J163/00; C09J179/08; H01L21/60
Domestic Patent References:
WO2016021646A1 | 2016-02-11 |
Foreign References:
JP2012156473A | 2012-08-16 | |||
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JP2021150614A | 2021-09-27 | |||
JP2019054120A | 2019-04-04 | |||
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JPH10226778A | 1998-08-25 |
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