Title:
ADHESIVE TAPE, ARTICLE AND METHOD FOR DISMANTLING ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/282310
Kind Code:
A1
Abstract:
The present invention provides an adhesive tape which is able to be removed by heating in a short time, while being capable of preventing thermal damage to an adherend, and which is removed by heating by an easy operation. The present invention provides an adhesive tape which comprises an adhesive layer A that contains a heating element and an adhesive, wherein: the heating element has a volume resistivity of 30 µΩ∙cm or more; and the adhesive layer A is melted or softened by means of resistance heating, thereby becoming removable. It is preferable that the adhesive is composed of at least one of a pressure sensitive adhesive and a hot melt adhesive; and it is preferable that the heating element is selected from the group consisting of Nichrome, stainless steel, titanium, nickel silver, and carbon.
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Inventors:
KIKUCHI HIROMASA (JP)
TAKEI HIDEAKI (JP)
TAKAHASHI YUSUKE (JP)
TAKEI HIDEAKI (JP)
TAKAHASHI YUSUKE (JP)
Application Number:
PCT/JP2022/026896
Publication Date:
January 12, 2023
Filing Date:
July 07, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/00; B32B7/025; B32B7/06; B32B7/12; C09J7/30; C09J201/00; H05B3/20
Foreign References:
| JP2017195182A | 2017-10-26 | |||
| JP2017222799A | 2017-12-21 | |||
| JP2019156914A | 2019-09-19 | |||
| JP2010118776A | 2010-05-27 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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