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Patent Searching and Data


Title:
ADHESIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/181401
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive tape that can stabily retain a wafer, chip, or similar during processing of a semiconductor wafer or similar. [Solution] An adhesive tape including a substrate and an adhesive layer that is provided on one surface of the substrate, wherein the loss tangent of the adhesive layer at 60°C is 0.40 or less, and the shear storage modulus of the adhesive layer at 60°C is 3.0×104Pa or greater.

Inventors:
HASEGAWA YUYA (JP)
KAKIUCHI YASUHIKO (JP)
MAEDA JUN (JP)
NISHIDA TAKUO (JP)
Application Number:
PCT/JP2019/007548
Publication Date:
September 26, 2019
Filing Date:
February 27, 2019
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/38; C09J201/00; H01L21/301; H01L21/304
Domestic Patent References:
WO2005090505A12005-09-29
Foreign References:
JP2013142132A2013-07-22
JP2013165206A2013-08-22
JP2012193295A2012-10-11
JP2015005598A2015-01-08
JP2016121231A2016-07-07
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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