Title:
ADHESIVE TAPE PROCESSING METHOD AND ADHESIVE TAPE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/210216
Kind Code:
A1
Abstract:
Provided is an adhesive tape processing method capable of easily separating a base material and an adhesive constituting an adhesive tape, at low cost. Also provided is an adhesive tape processing device for use with such an adhesive tape processing method. An adhesive tape processing method according to an embodiment of the present invention is a method for processing an adhesive tape including a base material layer and an adhesive layer, and includes a step (I) for separating an adhesive constituting the adhesive layer from the base material layer by polishing a surface of the adhesive layer of the adhesive tape, wherein the base material layer has a storage modulus of 2 MPa or more at 25℃.
Inventors:
YAMADA YOSUKE (JP)
YAMAMOTO AKIYOSHI (JP)
NOMURA TAKAYUKI (JP)
YAMAMOTO AKIYOSHI (JP)
NOMURA TAKAYUKI (JP)
Application Number:
PCT/JP2022/013731
Publication Date:
October 06, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B24B7/13; B24B21/12; B29B17/02; C09J7/38
Foreign References:
| JP2019209511A | 2019-12-12 | |||
| JP2020001262A | 2020-01-09 | |||
| JP2002120193A | 2002-04-23 | |||
| JPS62238710A | 1987-10-19 | |||
| JPH06114836A | 1994-04-26 | |||
| JP2012171276A | 2012-09-10 | |||
| JPH11241053A | 1999-09-07 | |||
| JPH11323280A | 1999-11-26 | |||
| JPH07113067A | 1995-05-02 | |||
| JP2002069411A | 2002-03-08 | |||
| JP2015074771A | 2015-04-20 | |||
| JP2014047280A | 2014-03-17 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
Download PDF: