Title:
ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2011/040498
Kind Code:
A1
Abstract:
Provided is a powdered thermosetting adhesive, the fluidity of which is so improved that a quantitative feeder or a conveyance passage can be prevented from being clogged with the powdered thermosetting adhesive. The powdered thermosetting adhesive comprises both particles of a thermosetting adhesive and an inorganic filler present on the surfaces of the particles.
Inventors:
HASHIMOTO AKINORI
IDEI HIROSHI
HISHINUMA HIDETOSHI
IDEI HIROSHI
HISHINUMA HIDETOSHI
Application Number:
PCT/JP2010/067006
Publication Date:
April 07, 2011
Filing Date:
September 29, 2010
Export Citation:
Assignee:
AKEBONO BRAKE IND (JP)
HASHIMOTO AKINORI
IDEI HIROSHI
HISHINUMA HIDETOSHI
HASHIMOTO AKINORI
IDEI HIROSHI
HISHINUMA HIDETOSHI
International Classes:
C09J201/00; B32B15/08; C09J5/00; C09J11/04
Foreign References:
| JPH0565468A | 1993-03-19 | |||
| JPS62174284A | 1987-07-31 | |||
| JP2004043674A | 2004-02-12 | |||
| JP2000088021A | 2000-03-28 | |||
| JP2000088021A | 2000-03-28 | |||
| JP2007113698A | 2007-05-10 | |||
| JP2004210875A | 2004-07-29 | |||
| JP2009227034A | 2009-10-08 |
Other References:
See also references of EP 2484740A4
Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
Shohei Oguri (JP)
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