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Patent Searching and Data


Title:
ALUMINUM NITRIDE POWDER, RESIN COMPOSITION, AND THERMALLY CONDUCTIVE MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2015/133037
Kind Code:
A1
Abstract:
The present invention provides, as an aluminum nitride powder having excellent water resistance, an aluminum nitride powder which has been surface-treated with a given organic compound. Also provided are: a resin composition comprising the aluminum nitride powder and a resin; and a thermally conductive molded object obtained by molding the resin composition.

Inventors:
HATAKEYAMA YOSHIHARU (JP)
FUJIKAWA KENICHI (JP)
YAMAGUCHI MIHO (JP)
YAMAGISHI YUJI (JP)
OOHASHI AKIHIRO (JP)
Application Number:
PCT/JP2014/083292
Publication Date:
September 11, 2015
Filing Date:
December 16, 2014
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
NITTO SHINKO CORP (JP)
International Classes:
C01B21/072; C08K3/28; C08K9/04; C08L101/00
Domestic Patent References:
WO2012147999A12012-11-01
Foreign References:
JPH0931356A1997-02-04
JPH02141410A1990-05-30
JPH10324510A1998-12-08
JPH09221306A1997-08-26
JPH09202608A1997-08-05
Other References:
See also references of EP 3115337A4
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
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