Title:
ANALYSIS CHIP MANUFACTURING APPARATUS, METHOD FOR OPERATING ANALYSIS CHIP MANUFACTURING APPARATUS, AND ANALYSIS CHIP MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/182434
Kind Code:
A1
Abstract:
An analysis chip manufacturing apparatus according to the present invention comprises: a rotary table that rotates around a central axis, and upon which substrates, that have not been coated with a selectively bondable material, are placed; a point-application head that comprises a plurality of point-application members that point-apply the selectively bondable material to raised parts, and are capable of moving in a scanning plane; and a control unit that controls, for each substrate, the rotation of the rotary table, the movement of the point-application head in the scanning plane, and the application of the selectively bondable material to the raised parts on the substrate. The control unit rotates the rotary table and/or moves the point-application head to a position such that the point-application members and the raised parts of the substrate corresponding to each of the point-application members overlap when viewed from the direction of the central axis of the rotary table, and causes the selectively bondable material to be applied to the raised parts.
More Like This:
Inventors:
TAKII YUKI (JP)
NAGINO KUNIHISA (JP)
NAGINO KUNIHISA (JP)
Application Number:
PCT/JP2021/009148
Publication Date:
September 16, 2021
Filing Date:
March 09, 2021
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G01N37/00; C12M1/00; C12N15/09; G01N33/53; G01N35/10
Domestic Patent References:
| WO2005085848A1 | 2005-09-15 |
Foreign References:
| JP2001021558A | 2001-01-26 | |||
| JP2006201035A | 2006-08-03 | |||
| JP2006242729A | 2006-09-14 | |||
| JP2003098172A | 2003-04-03 | |||
| JP2005214733A | 2005-08-11 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: