Title:
ANTI-FUNGAL COMPOSITION FOR WOOD MATERIALS
Document Type and Number:
WIPO Patent Application WO/2011/055775
Kind Code:
A1
Abstract:
Disclosed is an anti-fungal composition for wood materials, which is characterized by comprising at least one metal pyrithione compound selected from sodium pyrithione, zinc pyrithione and copper pyrithione and at least one copper compound selected from copper oxychloride, copper hydroxycarbonate, copper carbonate, copper sulfate, copper oxysulfate, copper acetate, copper oxide, copper naphthenate, cupric hydroxide, copper terephthalate, copper dodecylbenzenesulfonate bis(ethylenediamine), copper nonylphenolsulfonate, copper hydroxynonylbenzenesulfonate, copper polystyrene sulfonate and oxine copper. The anti-fungal composition can be used for preventing mold from getting on lumber, and can particularly prevent the contamination of woods by Zygomycetes fungi such as mucor fungi and rhizopus fungi effectively for a long period.
Inventors:
NEW MAYUMI (JP)
SAKATA KAZUHIKO (JP)
SAKATA KAZUHIKO (JP)
Application Number:
PCT/JP2010/069665
Publication Date:
May 12, 2011
Filing Date:
November 05, 2010
Export Citation:
Assignee:
ARCH CHEMICALS JAPAN INC (JP)
NEW MAYUMI (JP)
SAKATA KAZUHIKO (JP)
NEW MAYUMI (JP)
SAKATA KAZUHIKO (JP)
International Classes:
A01N43/40; A01N37/34; A01N47/18; A01N55/02; A01N59/20; A01P3/00; B27K3/22; B27K3/52
Domestic Patent References:
| WO2005040122A1 | 2005-05-06 |
Foreign References:
| JP2003522734A | 2003-07-29 | |||
| US5462589A | 1995-10-31 | |||
| JP2006335757A | 2006-12-14 | |||
| JPS61236702A | 1986-10-22 | |||
| JP2007106693A | 2007-04-26 | |||
| JP2009517496A | 2009-04-30 |
Attorney, Agent or Firm:
ASAMURA Kiyoshi et al. (JP)
Hiroshi Asamura (JP)
Hiroshi Asamura (JP)
Download PDF: