Title:
ANTI-SKID PACKAGING CASE FOR ELECTRONIC PRODUCT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2014/032263
Kind Code:
A1
Abstract:
An anti-skid packaging case for an electronic product, comprising an accommodation space formed by an upper case body (11) and a lower case body (12) and used for accommodating the electronic product; an anti-skid layer (13) disposed on the outer surface of the upper case body (11) and the lower case body (12) and used for decoration and anti-skidding; and a connecting piece (14) used to connect the upper case body (11) to the lower case body (12) and separating the accommodation space from the outside. Also disclosed is a manufacturing method of the anti-skid packaging case for an electronic product. The above method enables the anti-skid packaging case for an electronic product to have a strong anti-skid performance and a definite aesthetic appearance.
Inventors:
HAN YONG (CN)
Application Number:
PCT/CN2012/080807
Publication Date:
March 06, 2014
Filing Date:
August 30, 2012
Export Citation:
Assignee:
SHENZHEN JIAHONG IND CORP LTD (CN)
HAN YONG (CN)
HAN YONG (CN)
International Classes:
B65D30/02; B65D33/00; B65D33/25
Foreign References:
| CN201142995Y | 2008-11-05 | |||
| CN202043759U | 2011-11-23 | |||
| CN201226922Y | 2009-04-29 | |||
| CN201617310U | 2010-11-03 | |||
| CN201005191Y | 2008-01-16 | |||
| US20090136700A1 | 2009-05-28 |
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
深圳翼盛智成知识产权事务所(普通合伙) (CN)
深圳翼盛智成知识产权事务所(普通合伙) (CN)
Download PDF: