APPARATUS FOR CUTTING MATERIAL AND SYSTEM FOR CUTTING MATERIAL

Title:

APPARATUS FOR CUTTING MATERIAL AND SYSTEM FOR CUTTING MATERIAL

Document Type and Number:

WIPO Patent Application WO/2018/012844

Kind Code:

A1

Abstract:

The present invention provides an apparatus for cutting a material, comprising: a frame body installed on a conveying path of a material; a cutting means, mounted on the frame body, for cutting an end portion of the material being conveyed; a laser preheating means for preheating the material by irradiating a laser beam onto the material before being conveyed to the cutting means; and a blocking and reflection means for blocking the laser beam reflected to the cutting means and re-reflecting the laser beam to the material.

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JP3064072	METHOD AND INSTRUMENT FOR DETECTING SHAPE OF WELDED PART AT BUTT-WELDING
WO/2007/143181	APPARATUS FOR THE FABRICATION OF METAL WALL FRAME MEMBERS AND ASSEMBLY OF WALL FRAMES THEREFROM

Inventors:

HUH HYEONG-JUN (KR)
LIM CHOONG-SOO (KR)
KWAK SUNG-JOON (KR)

Application Number:

PCT/KR2017/007393

Publication Date:

January 18, 2018

Filing Date:

July 11, 2017

Export Citation:

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Assignee:

POSCO (KR)

International Classes:

B21B15/00; B21B45/00

Foreign References:

KR20150073565A	2015-07-01
KR20100107814A	2010-10-06
JPH02133281U	1990-11-06
KR20120017833A	2012-02-29
US4356376A	1982-10-26

Other References: