BACKGROUND

1. FIELD

The present disclosure relates to an apparatus and a method for improving signal integrity rig. In particular, the present disclosure provides for improving signal integrity probing by ding a conductive elastomer on a cable or a microcoaxial cable.

2. THE RELATED ART

Signal integrity probing requires good electrical connections. However there are ems that prevent good electrical connections from being formed with the contact surface to jbed. The contact surface that is the subject of the probing may typically have oxides, oils 3ris formed on its surface. Such deposits will make it difficult if not impossible to effect a probing contact and thus impair a good electrical connection. It would be desirable to effect electrical connections for improved signal integrity probing.

EVIARY

It would be desirable to provide a method and structure for improving signal integrity that s the drawbacks of the aforementioned problems. This is accomplished by providing a xl and structure for improving signal integrity probing by threading a coaxial or

•coaxial cable, having a conductive elastomer, thereon through an optional alignment rate where the cable is used to support or align the cable or an array of cables. BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a first embodiment of the present disclosure in which a ial or micro coaxial cable extends through an alignment substrate (which can be either a luctive or non-conductive substrate) and conductive elastomers are provided to the center luctor region in a column near where the where the shield of the cable and the top surface of ubstrate meet; and

FIG. 2 is a sectional view of a second embodiment of the present disclosure in which a ial or micro coaxial cable extends through an alignment substrate (which can be either a luctive or non-conductive substrate) and conductive elastomers are provided to the center iuctor region in a column near where the where the shield of the cable and the top surface of ubstrate meet and also applied to the bottom side of the substrate.

DETAILED DESCRD7TION OF THE PREFERRED EMBODIMENT(S)

Referring now to FIGS. 1 and 2 of the drawings, FIG. 1 shows a first embodiment of the jnt disclosure. In this embodiment a coaxial cable or a microcable 5 is threaded through an mal alignment substrate 10. This substrate 10 supports and aligns the cable or an array of 2S 5. The substrate 10 is preferably formed as either an electrically conductive metal or as an lator. The cable 5 has an outer metallic shell 6. The metallic shell 6 remains in intimate act with the substrate 10 and is preferably soldered 8 to provide good electrical connection.

The cable 5 has a top side 8 that is preferably flush with the top side 9 of the substrate 10. cable 5 has a bottom side 11 that is preferably flush with a bottom side 12 of the substrate 10 rtends outward from the bottom side 12 of the substrate 10 (as shown in FIG. 1) and is free ;cept a traditional connector or can be attached to an electronic assembly through any /entional techniques known in the art.

As seen in FIG.l, a conductive elastomer 13 is applied to the center conductor region 19 -dated from outer coaxial cables by coaxial dielectic 21) in a column 14. This conductive tomer 13 is preferably applied in the ground shielding region 15 where the shield of the cable d the top surface 9 of the substrate 10 meet. These conductive elastomeric regions are erably isolated from each other in order to prevent electrical shorting (as shown in FIGS. 1 2). Optionally a nonconductive substrate can be applied in the open areas on top 9 of the itrate 10 around the conductive elastomers 13 close enough to provide room for the elastomer 3 expand when it is compressed (as seen in FIG. 1 with compression stops 18) but will ent it from over compression and damage. In FIG. 1 a low contact resistance metal can be loyed to form a pad 16 having sharp points or "aspirates" 17 that are formed on top 9 of the itrate 10 to help penetrate oxides, oils of debris that may form on the subject contact point is intended to be probed.

As in FIG. 1, FIG. 2 illustrates a method and apparatus in which a low contact resistance il can be employed to form a pad 16 having sharp points or "aspirates" 17 that are formed on ⁾ of the substrate 10 to help penetrate oxides, oils or debris that may form on the subject act point that is intended to be probed. In addition in the embodiment of FIG. 2 this same ^; ture and method for the top side 9 of the substrate 10 can also be used for the bottom side 12 ie substrate 10 to provide for a high speed, high band width connector.

While presently preferred embodiments have been described for the purposes of the osure, it is understood that numerous changes in the arrangement of apparatus parts can be _ϊ by those skilled in the art. Such changes are encompassed within the spirit of the invention jfined by the appended claims.