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Title:
APPARATUS AND METHOD FOR PATTERNING CONDUCTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/200229
Kind Code:
A1
Abstract:
An apparatus for patterning a conductive material according to an embodiment of the present invention comprises: a transfer substrate on which a conductive material including a liquid metal is formed; a rotation part for moving the transfer substrate; a laser part for irradiating the conductive material with a laser beam; a stage which is positioned so as to be spaced apart from the transfer substrate, and on which an accommodation substrate for accommodating the conductive material is mounted; and a cooling part which is positioned adjacent to the transfer substrate, and which cools the conductive material.

Inventors:
CHANG WON SEOK (KR)
PARK CHEOL-MIN (KR)
CHOI WONSUK (KR)
CHO SUNG-HAK (KR)
Application Number:
PCT/KR2017/004607
Publication Date:
November 23, 2017
Filing Date:
April 28, 2017
Export Citation:
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Assignee:
KOREA INST MACH & MATERIALS (KR)
International Classes:
H01L21/3213; H01L21/02; H01L21/027; H01L21/268; H01L21/28; H01L21/56; H01L21/67; H01L21/687
Foreign References:
KR20010030491A2001-04-16
JPH11504760A1999-04-27
KR20050024261A2005-03-10
KR20150058075A2015-05-28
KR100832095B12008-05-27
Attorney, Agent or Firm:
PANKOREA PATENT AND LAW FIRM (KR)
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