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Patent Searching and Data


Title:
APPARATUS FOR PREPARING WAFER POLISHING PAD AND METHOD FOR PREPARING WAFER POLISHING PAD USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/033848
Kind Code:
A1
Abstract:
The present invention provides an apparatus, for preparing a wafer polishing pad, comprising: a polishing pad which has an upper pad having a plurality of lattice grooves and a lower pad attached to the bottom part of the upper pad; a first roller around which the polishing pad is wound; a buffing roller for buffing the upper pad of the polishing pad; and a second roller for feeding the polishing pad which is wound around the first roller to the buffing roller and discharging the buffed polishing pad, wherein the buffing roller and second roller rotate in the same direction.

Inventors:
SUNG JAE CHEL (KR)
Application Number:
PCT/KR2019/016909
Publication Date:
February 25, 2021
Filing Date:
December 03, 2019
Export Citation:
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Assignee:
SK SILTRON CO LTD (KR)
International Classes:
B24D18/00; B08B15/00
Foreign References:
JP2010179425A2010-08-19
JPH0740245A1995-02-10
JP2006231452A2006-09-07
KR20140062475A2014-05-23
JPH0727752U1995-05-23
Attorney, Agent or Firm:
LEE, Seung Chan (KR)
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