Title:
AQUEOUS BONDING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/022236
Kind Code:
A1
Abstract:
Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a phosphate; and (C) at least one neutralizing agent selected from ammonia and an amine compound having at least one hydroxyl group. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient and peeling strength and scarcely causes metal to rust. The aqueous bonding composition can be usefully used to produce a wood-based material.
Inventors:
KAKUDA ATSUSHI (JP)
YOSHIDA YOSHIO (JP)
YOSHIDA YOSHIO (JP)
Application Number:
PCT/JP2016/003545
Publication Date:
February 09, 2017
Filing Date:
August 02, 2016
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
B27N3/00; C08L97/02; C09D105/00
Domestic Patent References:
| WO2009010393A1 | 2009-01-22 | |||
| WO2010001988A1 | 2010-01-07 | |||
| WO2012133219A1 | 2012-10-04 |
Foreign References:
| US20070027283A1 | 2007-02-01 | |||
| US6982049B1 | 2006-01-03 | |||
| GB2451719A | 2009-02-11 | |||
| JPS56500414A | 1981-04-02 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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