Title:
AQUEOUS RESIN COMPOSITION, COATING FILM, COATING FILM PRODUCTION METHOD, AND AQUEOUS RESIN COMPOSITION SET
Document Type and Number:
WIPO Patent Application WO/2022/255272
Kind Code:
A1
Abstract:
An aqueous resin composition comprising an aqueous resin emulsion (α), a curing agent (β), and a curing accelerator (γ), wherein the aqueous resin emulsion (α) contains a copolymer (X), a polyepoxy compound (Y), and an aqueous medium (Z), the copolymer (X) includes structural units derived from a (meth)acrylic acid ester (A) and structural units derived from an ethylenically unsaturated carboxylic acid (B), the structural units derived from the (meth)acrylic acid ester (A) include a structural unit derived from a hydrophilic (meth)acrylic acid ester (A1), one or both of the copolymer (X) and the polyepoxy compound (Y) include a carboxy group, the curing agent (β) contains an aromatic polyamine (F) having active hydrogen, and the curing accelerator (γ) contains a tertiary amine not having active hydrogen.
Inventors:
KUZUTANI TAKUYA (JP)
MURATA NAOKI (JP)
MURATA NAOKI (JP)
Application Number:
PCT/JP2022/021819
Publication Date:
December 08, 2022
Filing Date:
May 27, 2022
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08L63/00; C08G59/50; C08L33/00; C09D5/02; C09D133/04; C09D163/00
Domestic Patent References:
| WO2020100790A1 | 2020-05-22 | |||
| WO2021112042A1 | 2021-06-10 |
Foreign References:
| JPH08188605A | 1996-07-23 | |||
| JPH08231616A | 1996-09-10 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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