Title:
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/085451
Kind Code:
A1
Abstract:
Provided is a copper/ceramic assembly in which a copper member (12) comprising copper or a copper alloy is bonded to a ceramic member (11) comprising a nitrogen-containing ceramic. A Mg solid solution layer in which Mg forms a solution in a Cu matrix phase is formed at a bonding interface between the copper member (12) and the ceramic member (11). An active metal nitride layer (41) containing nitrides of one or more active metals selected from among Ti, Zr, Nb and Hf is formed on the ceramic member (11) side of the bonding interface. The thickness of this active metal nitride layer (41) is 0.05-1.2 µm.
Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2020/040363
Publication Date:
May 06, 2021
Filing Date:
October 28, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/12; C04B37/02; H01L23/13; H05K3/38
Domestic Patent References:
| WO2018159590A1 | 2018-09-07 |
Foreign References:
| JP2001217362A | 2001-08-10 | |||
| JP2001048670A | 2001-02-20 | |||
| JP2019197656A | 2019-11-14 | |||
| JP2020179054A | 2020-11-05 | |||
| JP3211856B2 | 2001-09-25 | |||
| JP4375730B2 | 2009-12-02 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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