Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ASSEMBLY STRUCTURE FOR ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/168068
Kind Code:
A1
Abstract:
An electronic component provided with a component body (24) and a plurality of lead terminals (25) is inserted into and accommodated in an accommodating member (23), and the lead terminals are caused to contact each of a plurality of terminal fittings (22) held in the accommodation member to assemble the electronic component into the accommodation member. The lead terminals have contact parts (35) hanging down along the side surface facing the component body, the lead terminals being provided facing each of a pair of side surfaces positioned on mutually opposite sides of the component body (24) and being formed such that when the component body is rotated 180° and the positions of the pair of side surfaces positioned on mutually opposite sides of the component body are switched, at least one of the following differs before and after the switch: the number of lead terminals on the side surface, the distance between the contact part and the facing side surface of the component body, or the width dimension orthogonal to the extension direction of the contact part. Erroneous assembly of the electronic component can thus be prevented.

Inventors:
KAWAMURA YUKIHIRO (JP)
Application Number:
PCT/JP2014/059813
Publication Date:
October 16, 2014
Filing Date:
April 03, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
YAZAKI CORP (JP)
International Classes:
H01R33/74; H01R13/64
Foreign References:
JPS6385894U1988-06-04
JP2011040181A2011-02-24
JPH11225416A1999-08-17
JPS5946469U1984-03-28
JPS5539679U1980-03-14
Attorney, Agent or Firm:
TORANOMON-IP FIRM (JP)
Patent business corporation Toranomon intellectual property office (JP)
Download PDF:



 
Previous Patent: DISPLAY DEVICE

Next Patent: SELF-ADHESIVE SURFACE-PROTECTING FILM