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Patent Searching and Data


Title:
ATTACHMENT STRUCTURE FOR RESIN MOLDING
Document Type and Number:
WIPO Patent Application WO/2017/212518
Kind Code:
A1
Abstract:
Provided is an attachment structure for a resin molding, said attachment structure being suitable for reducing manufacturing costs of a product comprising a configuration in which a second resin molding is attached to a first resin molding, and for improving the workability of attaching the second resin molding to the first resin molding. This structure for attaching a second resin molding (6) to a first resin molding (5) is configured such that, with a hooking pawl (15) hooked in a hooking hole (11), the second resin molding (6) is rotatably moved in the direction of the first resin molding (5) about the hooking pawl as a base point, whereby an engaging structure for an outer peripheral engaging pawl (13) and an outer peripheral engaging portion (9) is set, and a boss-fitting portion (16) is brought near to and fitted over a boss (12), thereby setting a fitting structure for the boss and the boss-fitting portion.

Inventors:
ASO YUTA (JP)
Application Number:
PCT/JP2016/066726
Publication Date:
December 14, 2017
Filing Date:
June 06, 2016
Export Citation:
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Assignee:
KASAI KOGYO KK (JP)
International Classes:
F16B5/10; B60J5/04; B60R13/02
Foreign References:
JP2012081785A2012-04-26
JP2016007872A2016-01-18
JPH06294410A1994-10-21
JP2004108456A2004-04-08
JP2006205928A2006-08-10
JPS5412776U1979-01-27
US20110211931A12011-09-01
JPH08282395A1996-10-29
Attorney, Agent or Firm:
WADA Shigenori et al. (JP)
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