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Title:
ATYPICALLY-SHAPED DIAMOND DIE
Document Type and Number:
WIPO Patent Application WO/2018/123513
Kind Code:
A1
Abstract:
An atypically-shaped diamond die having a polycrystalline diamond, the polycrystalline diamond being provided with a machining hole, wherein the length D of one side of the machining hole is 100 μm or less, the corner R is 20 μm or less, a bearing part is provided, the surface roughness Sa of the bearing part is 0.05 μm or less, and the average grain diameter of the polycrystalline diamond is 500 nm or less.

Inventors:
SHINDO TOSHIAKI (JP)
ASANUMA TAKUYA (JP)
Application Number:
PCT/JP2017/044159
Publication Date:
July 05, 2018
Filing Date:
December 08, 2017
Export Citation:
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Assignee:
ALMT CORP (JP)
International Classes:
B21C3/02
Domestic Patent References:
WO2017073424A12017-05-04
Foreign References:
JPH09220610A1997-08-26
JPH05146820A1993-06-15
JP2016251570A2016-12-26
JP2005254311A2005-09-22
JP2003220407A2003-08-05
JP2003245711A2003-09-02
JPS4857531U1973-07-23
JP2008290107A2008-12-04
JP2008290108A2008-12-04
JP2005150310A2005-06-09
Other References:
"Innovative Ultra-hard Materials: Binderless Nano-polycrystalline Diamond and Nano-polycrystalline Cubic Boron Nitride", SEI TECHNICAL REVIEW NO. 188, January 2016 (2016-01-01)
See also references of EP 3536414A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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