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Title:
BASE MATERIAL FILM FOR DICING TAPES
Document Type and Number:
WIPO Patent Application WO/2021/149328
Kind Code:
A1
Abstract:
This base material film for dicing tapes contains a polyethylene resin and a polypropylene resin, while having a storage elastic modulus of from 20 MPa to 200 MPa at 100°C, a storage elastic modulus of from 10 MPa to 170 MPa at 110°C, a storage elastic modulus of from 5 MPa to 140 MPa at 120°C, and a stress (at 100% elongation) of 5 MPa or more but less than 20 MPa in MD.

Inventors:
ISHIMOTO TAKAYUKI (JP)
MIGUCHI YOSUKE (JP)
ONO HITOMI (JP)
SUGIYAMA HITOSHI (JP)
Application Number:
PCT/JP2020/041481
Publication Date:
July 29, 2021
Filing Date:
November 06, 2020
Export Citation:
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Assignee:
C I TAKIRON CORP (JP)
International Classes:
C08L23/10; C08L23/04; C08L55/00; H01L21/301
Domestic Patent References:
WO2015146596A12015-10-01
WO2019172220A12019-09-12
Foreign References:
JP2005340796A2005-12-08
JP2007030313A2007-02-08
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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