Title:
BINDER COMPOSITION FOR WOODEN BOARDS, WOODEN BOARD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/193042
Kind Code:
A1
Abstract:
A binder composition for wooden boards according to one embodiment of the present invention contains: a resol type phenolic resin; at least one kind of saccharide that is selected from the group consisting of a monosaccharide, a disaccharide and a trisaccharide; and an ester compound.
Inventors:
SAITOU TAKAFUMI (JP)
Application Number:
PCT/JP2021/009415
Publication Date:
September 30, 2021
Filing Date:
March 10, 2021
Export Citation:
Assignee:
GUN EI CHEMICAL IND CO LTD (JP)
International Classes:
B27N3/00
Foreign References:
JP2019171746A | 2019-10-10 | |||
JPH1158331A | 1999-03-02 | |||
JP2005119202A | 2005-05-12 | |||
JP2012201728A | 2012-10-22 | |||
JP2018058359A | 2018-04-12 |
Other References:
TOHMURA SHIN-ICHIRO: "Phenolic Resin Adhesives for Wood", JOURNAL OF NETWORK POLYMER, JAPAN, 1 January 2010 (2010-01-01), pages 240 - 247, XP055859165, Retrieved from the Internet [retrieved on 20211109], DOI: 10.11364/networkpolymer.31.240
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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