Title:
BINDING TAPE
Document Type and Number:
WIPO Patent Application WO/2022/102331
Kind Code:
A1
Abstract:
[Problem] To provide a binding tape that has high abrasion resistance and that is flexible to allow bending of electrical wires, and that is also excellent in binding efficiency. [Solution] A binding tape having a base material layer that comprises a nonwoven fabric and a resin layer layered on one surface of the nonwoven fabric, and a pressure-sensitive-adhesive layer, wherein the tensile elastic modulus in the longitudinal direction and width direction of the binding tape is 0.08-1.5 MPa. The mass per unit area of the nonwoven fabric is preferably 20-350 g/m2. The layered amount of the resin layer is preferably 20-350 g/m2.
Inventors:
TATE YOSUKE (JP)
YAMAMOTO YOSHIAKI (JP)
YOSHIMURA DAISUKE (JP)
YAMAMOTO YOSHIAKI (JP)
YOSHIMURA DAISUKE (JP)
Application Number:
PCT/JP2021/037979
Publication Date:
May 19, 2022
Filing Date:
October 14, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B5/02; B32B7/022; B32B27/00; B32B27/12; B65D63/10; C09J7/21; C09J201/00; D04H1/54
Domestic Patent References:
| WO2019069577A1 | 2019-04-11 | |||
| WO2020213521A1 | 2020-10-22 |
Foreign References:
| JP2009084481A | 2009-04-23 | |||
| JP2001040302A | 2001-02-13 | |||
| JP2004524376A | 2004-08-12 | |||
| JP2009137296A | 2009-06-25 | |||
| JP2011088654A | 2011-05-06 | |||
| JP2006210228A | 2006-08-10 | |||
| JPH11335637A | 1999-12-07 | |||
| JP2005162958A | 2005-06-23 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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