Title:
BLACKENED SURFACE TREATED COPPER FOIL AND COPPER FOIL WITH CARRIER FOIL
Document Type and Number:
WIPO Patent Application WO/2016/035604
Kind Code:
A1
Abstract:
Provided is a blackened surface treated copper foil having a treated surface that is blackened by fine roughening with the use of copper grains. The treated surface of the blackened surface treated copper foil has a root mean square slope RΔq of a roughness curve of 25 or less, said RΔq being measured in accordance with JIS B 0601 (2001), and a lightness index L* in L*a*b* color system of 30 or less, said L* being measured in accordance with JIS Z 8729 (2004) and JIS Z 8722 (2009). According to the present invention, a blackened surface treated copper foil, when bonded to a resin film and processed into a stripe- or mesh-type wiring for a touch panel, said blackened surface treated copper foil being capable of increasing the transparency of the film after etching the copper foil and imparting a desired black color sufficient for reducing the visibility of the stripe- or mesh-type wiring, can be provided.
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Inventors:
MIZOGUCHI MISATO (JP)
TOMONAGA SAKIKO (JP)
TOMONAGA SAKIKO (JP)
Application Number:
PCT/JP2015/073789
Publication Date:
March 10, 2016
Filing Date:
August 25, 2015
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D7/06; C25D5/16
Domestic Patent References:
| WO2013099726A1 | 2013-07-04 | |||
| WO2014133164A1 | 2014-09-04 |
Foreign References:
| JP2009004423A | 2009-01-08 | |||
| JP2009176768A | 2009-08-06 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Masaharu Takamura (JP)
Masaharu Takamura (JP)
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