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Patent Searching and Data


Title:
BLOCK COPOLYMER, RESIN COMPOSITION, STRETCH CONDUCTOR, ELECTRONIC DEVICE, AND PRESSURE-SENSITIVE ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2021/117723
Kind Code:
A1
Abstract:
A block copolymer according to the present invention consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20°C or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20°C, and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20°C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.

Inventors:
OBA KAZUTOSHI (JP)
MATSUDA YUKIE (JP)
MIZUNO YUKI (JP)
NAKAZATO ATSUSHI (JP)
GOTO ATSUSHI (SG)
Application Number:
PCT/JP2020/045680
Publication Date:
June 17, 2021
Filing Date:
December 08, 2020
Export Citation:
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Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
UNIV NANYANG TECH (SG)
International Classes:
C08F8/34; C08F293/00; C08K3/01; C08K7/02; C08L53/00; C09J7/30; C09J153/00; H01B5/02
Domestic Patent References:
WO2017188031A12017-11-02
Foreign References:
JP2003147312A2003-05-21
JP2017043741A2017-03-02
JPS4627532B11971-08-10
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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