BACKGROUND OF THE INVENTION

[0001] The present disclosure relates to boil profile or condition (hereinafter profile) detection and prevention as well as application of same with respect to control of heat generation as well as menu preparation. Cooktops are well known appliances for cooking foodstuff, the cooktops having surfaces in which heat may be generated by one or more heating elements and upon which utensils housing the foodstuffs may be placed for the imparting of the heat thereto resulting in the cooking of the foodstuff therein.

[0002] The foodstuff may include liquids with or without solid foodstuffs therein. For example, the liquids may comprise water or oil for boiling. A well-known use of the cooking oil is in the preparation of deep-fried dishes such as French fries and a well-known use of the water is in the preparation of pasta. The preparation of the French fries requires first heating the cooking oil until the oil reaches a certain desired temperature, and then introducing sliced potato portions into the oil so that the heated oil may deep fry the potato portions into the well- known French fries. The introduction of tire potato portions into the oil may cause the oil to bubble thereby creating a turbulent surface. Where the oil may be too hot or too little, undesired effects may occur, including: splashing of hot oil out of the utensil potentially on the appliance and/or user; insufficient cooking of the potato portions; damage to the utensil; oil boil over or Dry Pot, and so forth. Likewise, preparation of pasta entails introducing uncooked pasta into boiling water which, depending on the level of boil, may already be exhibiting a turbulent surface caused from bubbles created within the water rising to and breaking at the surface. Introduction of pasta into the water may at first calm the water (due in part to the induced temperature difference caused by the introduction) and then lead not only to a turbulent water surface but also a foaming thereby leading to a rise in the level of liquid in the utensil and boil over conditions. Conversely, the water may reduce, for example through evaporation, thereby leading to Dry Pot. Where the boil, namely heat generation, is not controlled, the liquid level may surpass the limits of the utensil causing a Boil Over with the liquid spilling out onto the appliance and conversely reduce to the point of ignition as per Dry Pot. Other applications involving the heating of liquid in a utensil include sauce reduction through simmering as well as soup preparation also through a summering. Still other applications include sous-vide wherein water is brought to and maintained at a particular temperature for a particular amount of time. Vacuum packed foodstuff is introduced into the water and by virtue of the heated water slowly cooked with barely any detectable disturbances, if at all, to the liquid surface.

[0003] In addition to the aforementioned drawbacks, cooking operations may be taxing on a chef of any skill set and level, with the chef being subject to numerous distractions and stresses which may lead to inferior cooking results, hazardous conditions and the like. Accordingly, there is a need to support, monitor and control the boiling of liquids when they are being cooked in utensils. The need would be robust extending across different cooking appliances and heat generation methods, including cooktop, free standing ranges with cooktop on top, hoods, microwave ovens and the like, as well as heat generation from induction, radiance and gas.

[0004] A boil profile for a liquid cooking in a utensil may include the following. Boiled liquid may be rolling or hard-boiled liquid, wherein large bubbles formed within the liquid rise quickly to the surface of the liquid thereby causing a turbulent liquid surface with rapidly changing surface levels; or an opposite, namely, soft boiled water, wherein small bubbles rise slowly to tire surface of the liquid with de minimis or non-turbulent impact on the liquid surface with slower changing levels. Further, a boiled liquid may overrun the banks of the utensil thereby leading to a potential spill over or Boil Over condition or reduce to the point of eminent Dry Pot. Other boil profiles are available as may be known in the art.

[0005] Current techniques for imparting heat upon a utensil via an appliance’s cooktop surface entail reliance upon the appliances’ control mechanisms. Attaining a certain boil profile is left to the user’s observations and assessments with the user being tasked with adjusting the control mechanisms in order to manually affect a change in or attainment of the select boil profile. With respect to the aforementioned, effective cooking includes reliance upon inconsistent user observational, interpretative powers and understanding of the respective menu and liquid level surface conditions or boil conditions as well as how they may apply to one another to appropriately determine appropriate heat setting for the appliance, as well as any subsequent cooking step such as an introduction of foodstuff into the liquid , at any particular time and for any procedural step of the respective menu currently under way. In addition and as touched upon above, the user is not afforded the opportunity and benefit of distraction least a disturbance to the menu preparation occurs and/or hazardous conditions arise, and the like, leading to self-evidently unwanted results. Accordingly, a need exists in the art for supporting tire user with foodstuff preparation wherein boil profiles are concerned.

[0006] A number of solutions have been proposed in the art to affect the aforementioned. For example, Bach, in United States Patent 9,109,805, proposes a range hood 115 including a number of temperature sensors 120, arranged in the range hood and positioned in either a one to one relationship to heating elements 105 on a cooktop surface 110 (see Figure 1) or one to all single sensor 140 for an entirety of the cooktop surface (see Figure 2). The temperature sensor may be used to detect the temperature of a heating element and/or of the cooktop surface in its entirety and/or that which is cooking on the heating element. Illumination warning devices 125 may be arranged to illuminate warning messages on particular dangerously hot heating elements (see Figure 3) or generally on and for the surface itself (see Figure 4). Bach is not concerned with boil profile detection as such.

[0007] Kamei, in US Patent Application 15/477,192, is directed to a cooking support system 100 that monitors cooking surface temperatures with the aid of: control device 110, processing unit 190, light emitter 191, camera 192 and overhead infrared sensor 193; all of which are positioned overhead from the cooktop 300. In operation, Kamei uses camera 192 to capture an image of a cooking surface including any cookware 400 that may be positioned thereon. The TR sensor is then used to detect a temperature of each cooking surface including any cookware atop the cooking surface. The temperature and location of temperature are fed to the processing unit which, in turn, is then used to recognize when portions of the cookware may be overheating. Upon detection of a dangerous condition, a warning to the cooktop operator is triggered via the light emitter emitting a particular warning light onto the cooktop. Kamei is not concerned with boil profile detection as such.

[0008] Johnson, in US Patent Application 14/924,900, is directed to a cooktop appliance 12 including a cooking surface 14 with heating elements 16 arranged to heat up cooking utensils 18. A cookware temperature sensor 28 and food sensor 30 associated with the cookware are further included whereby the food sensor is a probe which is physically positioned within the utensil 18 to physically engage foodstuff therein. Accordingly, tire sensor determines the temperature of the food. As with the aforementioned references, Johnson focuses on dangerous situations which, as may be the case here, may result in burnt food. Accordingly, measurements of both the different temperatures of the food and the utensil are taken and compared with a threshold. Exceeding the threshold is understood to be a warning situation necessitating prevention or remedial measures such as reducing the heat being generated under the particular food and utensil. Johnson is not concerned with boil profile detection as such.

BRIEF SUMMARY OF THE INVENTION

[0009] Accordingly, embodiments of the present disclosure are provided to substantially obviate one or more of the problems arising out of the limitations and disadvantages of the related art in providing a boil detection systems and solutions for appliances used in the detection of boil profiles or conditions condition (hereinafter profile(s)) in support of the preparation of foodstuff, including providing: a remote and contactless temperature sensor such that the appliance is within the sensor’s field of view, the temperature sensor being configured to detect a temperature of liquid in a utensil receiving heat on a cooktop surface of the appliance; a time of flight sensor with the appliance also in the sensor’s field of view, the time of flight sensor configured to detect a liquid level and rate of change thereof; and a processor appropriately arranged and configured to determine the boil profile based upon the temperature, disturbance level and liquid level.

[0010] Further embodiments of the present disclosure are directed to comparing the detected temperature, liquid level and rate of change thereof with particular thresholds in a determination of a particular boil profile. Embodiments may further include displaying a message to the user including at least the boil profile, liquid temperature, time or countdown, alarm, prevention or remedial measures and the like. A digital light processor may be included and appropriately set up to facilitate displaying and a communication module may be included and appropriately set up to facilitate implementation of prevention measures.

[0011] Still further embodiments include arranging the processor in a feedback with the controls of the appliance such that the processor may set a select temperature setting for the appliance to generate via its heating element. The select temperature may be based upon maintaining and/or achieving a particular liquid temperature and/or boil profile. The select temperature and/or boil profile may be set in response to or in preparation for execution of a menu step or sequence thereof, which may in turn be available and/or known to the processor. Herein, a change of liquid level may also be taken into consideration with respect to the introduction of foodstuff into the liquid (measured by liquid displacement), the introduction being at the behest of the user and/or in keeping with an execution of a menu step. ***The cooking assisting unit may further be applied across different cooking appliances and heat generation methods, such methods including but not limited to induction, radiance and gas. Such cooking appliances may include cooktops, flee standing ranges with cooktops on top, hood, microwave ovens and the like.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0012] The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate exemplary embodiments and, together with the description, serve to explain the disclosed principals.

[0013] Figures 1A and IB depict an overview of a boil detection system according to embodiments of the present disclosure.

[0014] Figure 1C depicts an operation of a temperature sensor.

[0015] Figure 11 depicts an application of a temperature sensor across a cooktop surface as may be found in Figure 1A.

[0016] Figure IE depicts an application of a temperature sensor on a cooktop heating element, including a pivoting of the temperature sensor.

[0017] Figure IF depicts application of a temperature sensor in a cooking environment.

[0018] Figure 1G depicts application of a time of a flight sensor to liquid level detection.

[0019] Figure 1H depicts an exploded view of a digital light processor.

[0020] Figure 2A depict a boil detection system mounted in a vent hood.

[0021] Figure 2B depicts a boil detection system mounted in a swing arm. [0022] Figure 3 A depicts an exploded view of the present boil detection system.

[0023] Figure 3B depicts an assembled view of the present boil detection system.

[0024] Figure 4A-4B depict applications of the present boil detection system.

[0025] Figure 5 depicts an example display generated by the present boil detection system.

[0026] Figures 6A-6D methods of operation of the present boil detection system.

DETAILED DESCRIPTION OF THE INVENTION

[0027] The technology described herein finds application in boil detection during foodstuff preparation within a utensil cooking on a heated surface of an appliance cooktop surface and a determining of the boil profile or condition (hereinafter profile) at the utensil Typically, a utensil used in food preparation is brought proximate to a heat source so that heat is transferred from heat source to utensil. Liquid may be accommodated within the utensil for cooking therewith and/or boiling thereof. As part of a menu preparation process, foodstuff, any substance that is used as food or to make a meal, may be added into the liquid. The boiling of tire liquid may be profiled into aboil profile that takes into consideration the liquid temperature, liquid level and rate of change of liquid level. Imparted heat on the utensil may have a direct impact on each of the aforementioned, making the controlled and monitored impartation an important element in the meal and/or menu preparation process.

[0028] Figure 1A depicts an overview of a boil detection system according to embodiments of the present disclosure, namely, an environment in which a first embodiment of the boil detection system 100 may operate. As shown, the boil detection system 100 is arranged above a cooktop 102 having a cooktop surface 104 with a number of heating elements (not shown) upon which a number of utensils 106 rest. Accordingly, the cooktop surface is within the boil detection system’s field of view 108. As may be envisioned, the boil detection system 100 may be arranged in any suitable location enabling and/or facilitating tire aforementioned.

[0029] The boil detection system 100 comprises at least one temperature sensor and at least one time of flight (ToF) sensor. The temperature sensor and ToF sensor may be a remote and contactless sensors operating in the infrared. Additionally, at least one digital light processor (DLP) assembly 110 may also be included; the DLP optionally operating by laser. At least one processor is included in the boil detection system 100, the processor being optionally arranged on a single board computer. Examples of known single board computers include the Beagleboard series available from Texas Instruments and Raspberry PI series available from the Raspberry PI Foundation. The processor may be arranged in communication with the cooktop and its controls in particular such that heat generation information, such as inputted or current temperature settings are communicated with the processor for subsequent consideration thereby, such comparisons including comparing detected data with certain thresholds indicative of a particular boil profile. The comparisons may be undertaken regularly and used to form a feedback control loop between processor and appliance so as to maintain a particular temperature generation, liquid temperature and/or boil profile. Such may be in keeping with a user selection and/or menu under preparation.

[0030] The temperature sensor may be arranged in electrical communication with the processor via the board upon which the processor is mounted such that output from the temperature sensor may be received and processed at and by the processor and the board in turn may power the temperature sensor. Such an arrangement may be made by appropriate connection of temperature sensor pins with a board’s input/output (I/O). Alternatively, the temperature sensor may be arranged remotely and in remote communication with the processor. The temperature sensor may comprise a sensor array and may operate in the infrared. The temperature sensor may be configured to enable a scanning of the cooktop surface and generate as well as communicate a temperature landscape of the cooktop surface including indications of local temperatures within the surveyed landscape. The temperature sensor may further be configured to selectively focus in on any particular point within the scanned landscape and measure a local temperature for subsequent selective communication.

[0031] A similar arrangement may be applied to and for the ToF sensor. Output from the ToF sensor may be received and processed by the processor in the generation of the aforementioned image. The ToF sensor may be arranged above the cooktop surface such that a location for a utensil fells within a line of sight of the ToF sensor and the ToF sensor may then in turn generate an output based upon a detected reflection, the output being subsequently processed to determine whether the utensil is present and a level of any liquid accommodated within the present utensil. Regarding liquid level, such output may be obtained successively and over time such that, for example, a rate of change of liquid within the utensil can be determined. Example applications of the aforementioned include monitoring an increase or decrease in liquid levels due to boiling.

[0032] A similar arrangement may be applied to the DLP which may also be arranged in electrical communication with the processor such that an image generated by the processor may then be selectively displayed at a select location outside the boil detection system 100 by the DLP. The select location may include the cooktop surface, utensil, foodstuff, nearby wall or surface and the like. The DLP may comprise a plurality of pins arranged in a matrix that line up with expansion headers of single board computers facilitating a plug-in arrangement.

[0033] The present boil detection system may further include one or more communication modules arranged in local or remote communication with the processor and configured to download potentially usefill information for the processor’s considerations during determinations made as required by the present boil detection system. Furthermore, the communication module may be configured to enable and facilitate communication between the processor and external elements, including querying information and information exchanges with data sources, the aforementioned inclusions in the present boil detection system and the like. Such usefill information may include criteria for different thresholds which may be encountered during operation of the present boil detection system, including particular temperatures as well as liquid levels and their respective particular times of detection which may be indicative of particular boil profiles. Additional information may include a presence and impact of particular foodstuff and utensils on such determinations. Further information may include impacts of foodstuff preparation recipes and their impact on the thresholds. Still further information may include languages, images and other means of machine-machine and machine-human communication. Still further information may include particular prevention or remedial measures, protocols and procedures to be executed upon determination of particular thresholds have been exceeded and/or hazardous conditions.

[0034] Other elements may be similarly included directly or remotely in the boil detection system including alarm generators), mounting elements, supporting optics and electronics and the like configured and arranged as would be envisioned by the skilled person. The sensors and/or DLP may comprise individual standalone components mounted on individual circuit boards or may be arranged in combination on a single circuit board. Cooktop 102 is depicted as a typical household appliance though it may comprise any suitable apparatus for generating heat applicable for cooking foodstuff which includes communication capabilities with the aforementioned processor, including cooktops, free standing ranges with cooktops on top, hoods, microwave ovens and the like. Heat generation may include radiant, induction, gas and the like as would be applied by the skilled person. The utensils 106 are depicted as common variety pots and pans for illustrative purposes.

[0035] Returning to Figure 1A, utensils 106 are positioned within a line of sight 108 of boil detection system 100. Temperature sensor and projector assembly 114 is arranged to enable temperature sensing of all of the cooktop surface 104 by way of a scan as well as display a select image directly on the cooktop surface, utensil and/or portions thereof. In particular, the select image displayed by the DLP comprises alphanumeric characters, images and colors within a utensil, as shown in Figure IB, for the convenience and ease of viewing and comprehending. Examples of image content are set out in Figure 5. As further depicted in Figure 1B, the boil detection system 100 may further include a fixing element for mounting the system, the fixing element comprising, for example, an adhesive layer 114.

[0036] With respect to temperature sensors, such as infrared (IR) sensors, depending upon application, the area to be measured (i.e., the target) should at least fill the instrument’s field of view if not largely overlap. For example, as depicted in Figure 1C, temperature sensor 120 has a field of view 122 on a proximate target 124 and distal target 126; the targets being intended for temperature measurement. Accordingly, first and second measurement spots 128 and 130 are created on the proximate and distal objects 124 and 126 respectively. The second spot 130 being about equal to the target size represents a good arrangement for assessing an overall temperature of target 126. In order to be sure to obtain temperature information from the entirety of the target, the measurement spots may be so expanded as to go outside the target, thereby guaranteeing that at least all of the target will be subject to temperature scan and measurement. The first measurement spot 128, being smaller than target 124, represents a good arrangement for selectively assessing a temperature in and at a more specific location, namely, a center and lightened portion of target 124. In addition to optical geometry as depicted in Figure 1C, geometrical optics may be used to adjust (widen or focus) a measurement spot size and location as well as the field of view generally. Temperature sensors may also be pivotably mounted to physically adjust location of the field of view, measurement spot and the like as depicted in Figure 1E. [0037] Figure ID depicts a temperature sensor configured for a wider field of view', namely, covering most if not all of the surface of a cooktop and beyond. As depicted, sensor 132 includes a field of view 134 which may be considered as a grid 136 the size of which matches the intended field of view. As shown, sensor 132 is of the 4-pin type that includes a reference tab RT along with clock line SCL, ground GND, supply voltage VDD and serial data signal SDA, all configured and arranged to enable electrical connection and communication with the aforementioned processor via an I/O. In operation, by virtue of the depicted field of view, sensor 132 may determine a scan for temperatures and distributions of same on the cooktop surface 138 with the same finding representation in grid 136. With reference to Figure IE, the temperature sensor 140 may be selectively pivoted 142 in order to direct its field of view 144 and measurement spot 146 in particular on a desired location on the cooktop surface, such as heating element 148.

[0038] Operation of a temperature sensor in a kitchen environment is depicted in Figure IF. As shown, cooktop surface 150 emits thermal radiation 152 to be collected and measured by temperature sensor 160 in a smoky and/or humid environment 154. Facilitating thermal radiation collection, the sensor 160 includes optics 156 arranged to focus incident radiation and correct for any potential environmental obstructions onto photosensitive detectors 158 which then convert the incoming thermal radiation into electrical signals via amplification 162 and electronics 164. Other temperature sensor arrangements, including for example use of thermopiles, may be applied here by way of design choice. The electrical signals may then be converted into temperature values and further processed with respect to, for example, recipe steps, by the aforementioned processor or by other remote processing functionality. Accordingly, the instant temperature sensor operates in a contactless and remote manner so as not to obstruct or interfere with the cooktop environment nor potentially impact or damage foodstuff, utensils and the like operating or present in such environments.

[0039] In an embodiment and with general reference to Figure 1G, the boil detection system 100 includes at least one time of flight (ToF) sensor configured for detecting a presence or absence of a utensil along with a level and change of level of liquid contained in a utensil which is located in the ToF sensors’ field of view. As depicted, ToF sensor 180 includes transmitter 170 arranged to transmit a signal of known speed at and into utensil 184. The signal may comprise infrared light. The light is reflected by and from the utensil, the detection of which confirms the utensil’s presence. The light may further reflect off of the surface of liquid present in the utensil. As depicted, starting with where no liquid is present in the utensil, light incidence 186 is reflected 188 off the internal bottom 190 of the utensil. A lowest liquid level 183 produces a first reflection 192 based upon a first incidence 191. Should the liquid rise, for example to a next higher level 181 , as may be the case with boiling, a second reflection 194 is produced from a second incidence 193. Likewise, third and fourth reflections (196, 198) may be produced by third and fourth incidences (195, 197) at next higher levels (178, 176). Similarly, where liquid initially starts from a higher level and evaporates, as may be the case from reducing, the aforementioned would mn in the inverse. Functionally, the ToF sensor may operate to statically determine a single liquid level in a single point in time; or non-statically determine a change in level height over a period of time through successive measurements of the liquid level height thereby generating a rate or change over time. The time may be set as envisioned by the skilled person in applying the present embodiments to particular applications. The distance to the liquid level at any particular time may be determined by analyzing the time difference between the time of a particular emission, signal 171, and time of receipt of a particular reflection or return signal (173, 175, 177, 179, 188) to the sensor 180 after being reflected by the respective surface level of liquid (176, 178, 181, 183, 190). A number of different analysis may be applied for this calculation without departing from the spirit of the present embodiments. One such calculation entails multiplying the speed of the infrared light times the time of flight (to and from the liquid surface) and then divide the product by 2. Timer 174 may be employed to start during the exit of the infrared light and run until the respective return reflection is detected. The aforementioned processor may be appropriately configured and programmed to affect the aforementioned.

[0040] A functional depiction of a DLP is set out in Figure 1H, wherein, the digital light processing element 401 comprises a DLP Chip Board 400 on which processor 402, digital micromirror device (DMD) 404 and memory 416 are suitably mounted and configured. Incident radiation 409 from source 410 is color filtered 408 and focused, via for example a shape lens 406, onto DMD 404 from which an image 420 may be generated and projected 418 onto a screen 412. As applied to the embodiments set out herein, the projected image may comprise select images, alphanumeric text and/or color and/or the like which is then selectively projected onto a screen of the cooktop surface, utensil, liquid and/or foodstuff, and the like. [0041] As depicted in Figure 2A, the boil detection system 100 may be mounted on an underside of a vent hood 200 above and overlooking a cooktop surface 104. In this example arrangement, the sensor field of view 108 is adjusted so as to train on heating element 202 so as to create a measurement spot 206 on a particular part of the heating element 202. As depicted in Figure 2B, the boil detection system 100 may be mounted on a swing arm 210 so as to be selectively arranged above cooktop surface 104. Alternatively, the boil detection system may be mounted within or below a microwave oven (not shown).

[0042] Figure 3A depicts an exploded view and Figure 3B depicted an assembled view of a boil detection system 100 according to various embodiments of the present disclosure. With general reference to both figures, arrangement 100 includes a top housing 300 configured to mate with abase housing 314 by way of example clamps and clamp openings (301, 303) which may be arranged in a fixing relationship to mechanically fix the top housing 300 and base housing 314 together. Magnets 302 may be arranged on top of the top housing 300 for magnetically mounting the boil detection system 100 as for example depicted in Figures 2A- 2B, while other mounting elements may be used with or in place of the magnets, including adhesive layers, mechanical couplings and the like.

[0043] The order of the elements accommodated within boil detection system 100 are set out in an illustrative order. Board 318 may comprise the aforementioned single board computer arranged and configured to facilitate electrical communication with other elements housed within the boil detection system 100 as well as with external devices by virtue of wireless communication. A sensor board 310 is further arranged to be in electrical communication with board 318 facilitating, together with board 310, accommodation and operation of the aforementioned sensors, including the temperature sensor and time of flight sensor (not shown). As such, the sensors may be individually mounted on separate boards or collectively arranged on a single board.

[0044] Board 318 may be arranged on a bottom 313 and within tire confines of base housing 314, proximate to sensor board 310 and clear cover 312 which overlays opening 305 in the base housing. Optics holder 316 is arranged over sensor board 310, the optics holder 316 including accommodations for a lens holder 320 thereon. Within lens holder 320 are a number of optical elements including an optical lens 326 and a lock ring 328 locking the optical elements within the lens holder. Clamp 324 configured to overlay the lens holder 320 and mate with the optics holder 316 is arranged to hold the lens holder 320 in place while fixed to the optics holder 316. A mirror 304 is arranged proximate to the clear cover 312 at an angle, such as 45 degrees, such that radiation impinging thereon is reflected fiom the lens arrangement through the clear cover and out the opening 305 in the direction of the cooktop surface (not shown). A DLP, such as digital light processor display evaluation module 322 is arranged herein and configured to selectively project and display the image including real time cooking information below the boil detection system with the processor, being in electrical communication with the DLP, generating the image and controlling the display location. The DLP may be of the compact, plug and play variety suitable for mobile projectors, appliances and the like. Its features may include an own chipset, such as the DLP200 (nHD), optical engine which may support up to 30 lumens, and an 8/16/24-bit RGB parallel video processor interface. The DLP may be board ready via an underside which includes pins arranged and configured to plug into an aforementioned single board computer and the like. The DLP may- be further configured by the skilled person to generate free-form and on-demand displays.

[0045] Other features may be included and/or substituted as would be understood by the skilled person. Forms and adhesive gaskets typically used for accommodating components in a housing are not shown for clarity purposes but would nonetheless be understood by the skilled person to be included and arranged within the boil detection system 100.

[0046] Operation of the boil detection system, according to embodiments described herein, will now. Boil profile detection entails obtaining data relating the temperature of the liquid along with the liquid’s level and change thereof as well as the status of disturbance of the liquid’s level from the arrival of bubbles upwards fiom within the liquid. The temperature sensor is used to detect the water temperature and the ToF sensor is used to determine the state of the liquid.

[0047] As depicted in Figure 4A, utensil 400 is arranged on a heating element 402 of appliance 404. The boil detection system 100 includes two sensors, a first ToF sensor 410 and a second combination ToF and temperature sensor 408. The ToF sensor is depicted with the temperature sensor as a combined unit for illustration purposes. As shown, the combined ToF and temperature sensor 408 includes a first field of view 406, while the ToF sensor 410 includes a second field of view 412. The sensors (408, 410) are arranged above the utensil 400 such that water 414 accommodated within the utensil 400 falls within the two sensors’ fields of view (406, 412). Accordingly, the temperature of the water 414 can be detected using the temperature sensor 408, while a first distance 416 (e.g. 694 mm) between ToF sensor 410 and the Equid surface 418 and a second distance 420 (e.g. 60 mm) between the liquid surface 418 and based on the utensil bottom (or alternatively heating element or cooktop surface or the like) 422 is measured by the ToF sensor 410. Such measurement may be made via advanced knowledge of the sensor utensil bottom distance and subtracting the first distance 416. The temperature and distance data may be communicated to the processor and the detecting of such data may be repeated after a select time T. Such time can be a matter of milliseconds, hundreds of milliseconds and other times as would be necessitated and dictated by application to particular situations (e.g. utensil type or liquid type) and/or environments. As shown in Figure 4B, after time T, the level of liquid has changed 424, with tire illustrative height rising by, for example, 40 mm. The aforementioned processor (not shown) is appropriately arranged and configured to receive the data and via appropriate programming, configuration and arrangement determine a rate of change of liquid level over time. Where the rate of change in height, up and/or down, is equal to or greater than an absolute value of 5mm for a time T, a boil profile of a Hard Boil is determined. Where the rate of change is less than 5mm for a time T, a boil profile of a Soft Boil is determined. Other absolute values may be implemented as dictated by particular application.

[0048] The processor may be further configured to automatically engage the appliance for temperature control and safety purposes. For example, the processor may be provided with an ideal liquid level height, boil profile and temperature, by time and with respect to preparation steps of a menu. The processor may then be made to timely determine the ideal liquid level, level height, boil profile and temperature for the current point in time and then compare the ideal with the actual liquid level, level height, boil profile and temperature so as to determine differences for prompt remedying through appropriate adjustment of the heat setting of the appliance by the processor as may be affected, wired or wirelessly, via the aforementioned communication module. Such may be repeated by way of a feedback loop for current and subsequent menu preparation steps. Alternatively, the aforementioned feedback loop may be applied to an ideal temperature simply desired by a user absent of any specific menu. The processor would then be appropriately configured to receive an indication of the ideal temperature, from user and/or appliance, affect timely determinations of actual temperature, boil profile and/or temperature, and affect respective changes via changes to the appliance setting so as to reach and/or maintain the ideal through reduction of any determined differences between it and the actual. The ideal and actual for any of the aforementioned may comprise one or more of the aforementioned temperature, boil profile and liquid level.

[0049] The processor may further be configured to communicate a next menu preparation step and/or action required for the same. Such may further be in response to certain temperature, level and boil profile detections having occurred at a particular time during the performance of the menu which may be indicative that a current preparation step is completed or about to be completed and/or being deviated from to an extent which requires chef information and/or a particular intervention to heat application, generation and the like.

[0050] Further, the measured data may be compared with thresholds associated with wanted, unwanted and/or hazardous conditions. For example, a fast boil of milk may be pre- programmed into the processor for it to control the appliance in order to boil milk until a particular foam level, temperature and the like has been detected and then promptly and automatically turn off the appliance. Likewise, a user may instruct the processor to not let liquid currently cooking on the appliance cooktop surface to boil or achieve a particular boil profile and, in the event the boil condition or particular boil profile is detected by the processor, the processor automatically reduces the heat generation. Such may be applied to the cooking of pasta and the automatic detection of the rise of foam due to the boiling water and automatic reduction of foam be reducing the heat below the utensil. The processor may further be provided with parameters descriptive of a hazardous situation (e.g. Boil Over conditions, ignitable oil temperature and level conditions, etc.) and, in the event such parameters are detected, the processor may initiate prevention and/or remedial measures such as safety turn- off of the appliance as well as introduction of other prevention or remedial measures including the introduction of suppression materials, sounding of an alarm and automatically reaching out for help. Other such measures may include at least one of an audio alarm, visual alarm, appliance safety switch-off and affecting heat generating at the heating element by instructing the appliance cooktop to initiate, increase, reduce or cease heat generation at the heating element. Such instructing may be successive an altered accordingly. [0051] The boil detection system may further display a message to the user, the message being directly displayed on the liquid, the utensil, the appliance and/or another surface. The message may include alphanumeric text, colors and images, with an example of same being depicted in Figure 5. As shown, image 500 includes a text message that a boil has been detected 502, and in keeping with the aforementioned, the heating element of the appliance cooktop surface has been turned off (504) by way of prevention of unwanted subsequent steps arising from the continued application of heat at its current heat generation levels. Such communication is not limited to depicted images and may include wired or wirelessly communicated electronic messages, audio alarms and the like. Other information may be projected, including temperature, time duration, level, boil profile and the like. Such projection may be made within the utensil on the liquid, on the cooktop surface or on another surface.

[0052] The present boil detection system according to embodiments disclosed herein may operate according to steps depicted in Figure 6A-6D. The overall method begins (Start, 600) and proceeds to the measuring of a current liquid temperature 601 of liquid accommodated in a utensil cooking on a cooktop surface . The current liquid level is then measured (602) followed by a determination of a rate of change of the liquid level over a time T as would be taken from successive measurings (603). A boil profile based upon at least the liquid temperature, current liquid level and rate of change of the liquid level may then be determined (604). Determination of two boil profiles are depicted, a first in Figure 6B (Soft Boil and Hard Boil, connector A) and a second in Figure 6C (Boil Over, connector B). The two connectors are depicted successively by dotted arrow, though their order of performance is a matter of design choice. Following a determination of a boil profile, as depicted by dashed arrow 626 and connector E coming from the boil profile determinations, a query is made as to whether cooking support (624) by way of for example the aforementioned heat adjustments to achieve a desired boil profile should be provided. If the query answer is in the negative, the method loops back to start (600). If the query answer is in the affirmative (615), the method continues with the provision of same via connector C (607) and thereafter ends (646). Alternatively, the method may loop back to previous steps in place of ending as will be detailed hereinbelow.

[0053] Figure 6B depicts a method for determining whether the boil profile may comprise a Soft Boil or a Hard Boil. As depicted, the method starts via Connector A (605) and proceeds with a determination of whether the temperature of the liquid is equal to or beyond the liquid’s boiling point (609). Where it is determined that the temperature falls below the boiling point (610) then the boiling profile is understood and determined to be Not Boiling and the method returns to the above steps as depicted in Figure 6A via connector E (660). Where the liquid temperature is determined to be equal to or greater than the liquid’s boiling point (611), the method continues with a determination (612) of whether a rate of change of the liquid level over time T is greater than or equal to 5 millimeters. The time and distance may be selectively set so as to correspond to particular liquids, utensils, cooking conditions and the like. Where the query' 612 is positive (615) that the rate of change is equal to or greater than 5 millimeters, then it is understood, and the determination made, that a Hard Boil is present and therefore the boil profile is that of a Hard Boil (616). The method then proceeds to a next determination, namely, whether the boil profile may be a Boil Over (via connector B, 606). Likewise, where the query 612 is negative (613) that the rate of change is equal to or less than 5 millimeters, then it is understood, and the determination made that a Soft Boil is present and therefore the boil profile is that of a Hard Boil (614). Hereto, the method then proceeds to a next query, namely, whether the boil profile may be a Boil Over (via connector B, 608).

[0054] In Figure 6C, a method is depicted for determining whether the boil profile may comprise Boil Over. Starting with connector B (606), the method proceeds with a query (609), as with in Figure 6B, of whether the liquid temperature exceeds the liquid’s boiling point (609). Where there does not exceed the boiling point (610), then the boiling profile is understood to be no longer boiling, the boil profiled is determined to be Not Boiling and the method returns to the steps depicted in Figure 6A via connector E (660). Where the temperature does exceed tire boiling point (611), namely the answer to query 609 is positive, then a determination is made whether the current level of liquid is less than or equal to the depth of the utensil portion which accommodates the liquid therein (612). Where the answer to query 612 is negative (617), then a Boil Over is understood to be present (double negative) and the boil profile is determined as comprising a Boil Over (614). An alarm (656) is then generated to alert at least the user of tire Boil Over boil profile. The alarm may comprise a depicted image, an audio alarm, electronic message and/or prevention or remedial measures. The method then returns to the aforementioned steps discussed with respect to Figure 6A by way of connector E (660). Where the query 612 is answered in the positive (618), the method continues with a query of whether a current rate of liquid level change will result in a level exceeding the utensil depth within a time T (620), the time being set by particular application. If the level is determined to exceed the utensil depth (619), then it is understood and determined that an Eminent Boil Over is present and the boil profile is set to Boil Over (614) and the alarm (656) is generated. The method then proceeds along connector E (660). Where query 620 is negative (622), then it is understood and determined that no Eminent Boil Over is present and the method returns via connector E (660).

[0055] Returning to Figure 6A, at connector E (660), a query is made whether cooking support is sought (624). The continuation from the boil profile determination to query 624 is indicated by dashed arrow 626. Where it is determined that no support is sought or needed (616), as may- be from user or appliance input (or lack thereof), the method returns to start. Where it is determined that support is sought (615), the method continues via connector C (607) to the steps depicted in Figure 6D.

[0056] Starting with connector C (607), the steps of Figure 6D proceed with storing a cooking profile into memory (630) or otherwise making it available. Such profile may be obtained by the aforementioned processor: effectively recording changed temperature, liquid level and rate of change of liquid level over a period of time and/or obtaining such information from a download or user/appliance input. Such information comprises ideal temperatures, liquid levels and rate of change of liquid levels at select times or cooking durations as may be based upon a menu or other input. The method then continues with at least one of three determinations (depicted by way of dashed lines), namely: 632(a) determining a difference between a current liquid temperature and an ideal temperature; 632(b) determining a difference between a current liquid level and an ideal liquid level; and 632(c) determining a difference between a current rate of change of liquid level and an rate of change of ideal liquid level. Where none of any of the aforementioned differences are detected (644), a next query is made, by way of connector F (634), as to whether the current menu or user/appliance selected cooking profile is at an end (636). Where the answer to the query 636 is positive 638, the method returns to the overall method start via connector D (608). Where the answer to the query' 642 is negative (640), the method returns to the local start by way of connector C (607) to repeat this process. Returning to the three queries 632(a), 632(b) and 632(c), where any of the relevant differences are detected, a query as to whether foodstuff should be present (642) is made. Such determination may be affected by the processor querying relevant menu steps or user/appliance input(s). Where the query 642 is negative, 644, tire processor affects a heat adjustment (647) at the appliance so as to reduce or close the detected difference(s). Where the query 642 is positive (645), a next query (648) is made whether foodstuff is actually present in or introduced into the liquid, the determination being made by detecting sequentially detected liquid level differences indicative of an addition of a foodstuff which would be known to displace the liquid by the mass of the foodstuff so introduced. A time of such introduction may also be determined and compared with respective menu steps or other input for confirmation (not shown). Where the answer to the query 648 is positive (650), the aforementioned heat adjustment of step 647 is performed, albeit with consideration for the present foodstuff, to be followed by a return to local start via connector C (607). Where answer to the query 648 is negative (652), a suitable alarm (654) is generated (656) followed by a return to start via connector C (607). The alarm may take the form of a visual and/or audio display as well as communicated text or other type of message with respect to the requirement for adding the foodstuff In addition to or as an alternative to consideration of present foodstuff, the method may also be applied with consideration of utensil type, appliance type, cooking environment and other such factors.

[0057] The communication functionality of the present embodiments may comprise network and communication chips, namely, semiconductor integrated circuits that use a variety of technologies and support different types of serial and wireless technologies as envisioned by the skilled person. The processor functionality of the present embodiments may be disposed in communication with one or more memory devices, such as a RAM or a ROM, via a storage interface. The storage interface may connect to memory devices including, without limitation, memory drives, removable disc drives, etc., employing connection protocols such as serial advanced technology attachment, integrated drive electronics, IEEE- 1394, universal serial bus, fiber channel, small computer systems interface, etc. The memory drives may further include a drum, magnetic disc drive, magneto-optical drive, optical drive, redundant array of independent discs, solid-state memory' devices, solid-state drives, etc. The memory devices may store a collection of program or database components, including, without limitation, an operating system, a user interface application, a user/application data (e.g., any data variables or data records discussed in this disclosure), etc.

[0058] It will be appreciated that, for clarity purposes, the above description has described embodiments of the technology described herein with reference to different functional units and processors. However, it will be apparent that any suitable distribution of functionality between different functional units may be used without detracting from the technology described herein. Hence, references to specific functional units are only to be seen as references to suitable means for providing the described functionality, rather than indicative of a strict logical or physical structure or organization.

[0059] The specification has described systems and methods for improving use of cooktops arising from attention to safety and foodstuff preparation by way of display and communication of real time cooking information. The illustrated steps are set out to explain the exemplary embodiments shown, and it should be anticipated that ongoing technological development will change the manner in which particular functions are performed. These examples are presented herein for purposes of illustration, and not limitation. Further, the boundaries of the functional building blocks have been arbitrarily defined herein for the convenience of the description. Alternative boundaries can be defined so long as the specified functions and relationships thereof are appropriately performed. Alternatives (including equivalents, extensions, variations, deviations, etc., of those described herein) will be apparent to persons skilled in the relevant art(s) based on the teachings contained herein. Such alternatives fell within the scope of the disclosed embodiments.

[0060] It is intended that the disclosure and examples be considered as exemplary only, with a true scope of disclosed embodiments being indicated by the following claims.