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Patent Searching and Data


Title:
BOILING COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/186885
Kind Code:
A1
Abstract:
This boiling cooling device is used with a refrigeration cycle apparatus. The boiling cooling device includes: a boiling unit; a condensing unit; and refrigerant piping. The refrigerant piping connects the boiling unit and the condensing unit. The condensing unit is in the form of a pipe. Refrigerant piping of a refrigerating device that connects an evaporator and a compressor of the refrigeration cycle apparatus passes through inside the condensing unit. The condensing unit of the boiling cooling device and the refrigerant piping of the refrigerating device of the refrigeration cycle apparatus provide a double-pipe structure. A refrigerant of the boiling cooling device can directly exchange heat through the refrigerant piping of the refrigerating device by directly touching the external surface of the refrigerant piping of the refrigerating device. The refrigerant can be reliably condensed in the condensing unit of the boiling cooling device.

Inventors:
SEKIYAMA MIKITO (JP)
TANAKA HIRONAO (JP)
OOMI YASUMITSU (JP)
YOSHINORI TAKESHI (JP)
Application Number:
PCT/JP2021/001942
Publication Date:
September 23, 2021
Filing Date:
January 21, 2021
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
B60K11/04; B60K1/04; F02M31/20; F25B1/00; F28D15/02; F28D15/04; F28F1/16; F28F1/36
Foreign References:
JPH04132446U1992-12-08
US4938036A1990-07-03
JP2019074301A2019-05-16
JP2016095132A2016-05-26
JP2013017279A2013-01-24
US20100229577A12010-09-16
US20140260403A12014-09-18
US6394076B12002-05-28
Attorney, Agent or Firm:
YAHAGI Kazuyuki et al. (JP)
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