Title:
BONDED BODY, HEAT SINK-ATTACHED INSULATED CIRCUIT BOARD, AND HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2020/111107
Kind Code:
A1
Abstract:
Provided is a bonded body in which an aluminum alloy member formed of an aluminum alloy is solid-phase diffusion bonded with a copper member formed of copper or a copper alloy, and which has an excellent thermal cycle reliability, excellent heat dissipation characteristics, and excellent strength. The bonded body includes an aluminum alloy member (31) bonded with a copper member (13B), wherein the aluminum alloy member (31) has an Si concentration in the range of 1.5-12.5 mass%, an Fe concentration of not more than 0.15 mass%, and a Cu concentration of not more than 0.05 mass%. The aluminum alloy member (31) and the copper member (13B) are solid-phase diffusion bonded, and the ratio t2/t1 is in the range of 1.2-2.0 where t1 is the thickness of a first intermetallic compound layer (41) including a θ phase and disposed on the side of the aluminum alloy member (31), and t2 is the thickness of a second intermetallic compound layer (42) including a non-θ phase other than the θ phase and disposed on the side of the copper member (13B).
Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2019/046332
Publication Date:
June 04, 2020
Filing Date:
November 27, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B23K20/00; C22C21/00; H01L23/36; H01L23/40
Foreign References:
| JP2016168625A | 2016-09-23 | |||
| JP2018222347A | 2018-11-28 | |||
| JP3171234B2 | 2001-05-28 | |||
| JP2014160799A | 2014-09-04 | |||
| JP2014099596A | 2014-05-29 | |||
| JP2016208010A | 2016-12-08 |
Other References:
See also references of EP 3888836A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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