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Title:
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/112060
Kind Code:
A1
Abstract:
This copper/ceramic bonded body (10) is obtained by bonding copper members (12, 13) that are formed of copper or a copper alloy and a ceramic member (11) that is formed of a nitrogen-containing ceramic; an active metal nitride layer (41), which contains a nitride of one or more active metals that are selected from among Ti, Zr, Nb and Hf, is formed on the ceramic member (11) side between the copper members (12, 13) and the ceramic member (11); an Mg solid solution layer (45), wherein Mg is solid-solved in a matrix of Cu, is formed between the active metal nitride layer (41) and the copper members (12, 13); and Cu-containing particles (42), which are composed of either or both of Cu particles and compound particles of Cu and an active metal, are dispersed within the active metal nitride layer (41).

Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2020/044596
Publication Date:
June 10, 2021
Filing Date:
December 01, 2020
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C04B37/02; B23K20/00; H01L23/13; H05K1/03
Domestic Patent References:
WO2018159590A12018-09-07
WO2019146464A12019-08-01
Foreign References:
JP2014091673A2014-05-19
JP2013211546A2013-10-10
JP2003192463A2003-07-09
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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