Title:
BONDED BODY MANUFACTURING METHOD AND MANUFACTURING DEVICE, AND FABRIC BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/065371
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a bonded body. The method for manufacturing a bonded body comprises: a first step for coating a hot melt adhesive on a first surface treatment area of a first fabric that has the first surface treatment area on its surface, thereby forming an adhesive layer; and a second step for placing a second fabric on the adhesive layer and bonding the first fabric and the second fabric via the adhesive layer to obtain a bonded body. In the method for manufacturing a bonded body, the second fabric may have a second surface treatment area on its surface. In this case, the second step can be a step in which the second surface treatment area of the second fabric is placed on the adhesive layer.
Inventors:
KAWAGUCHI AKIKO (JP)
YOKOYAMA KOSUKE (JP)
OHKODA YOHEI (JP)
TANAKA KAHO (JP)
YOKOYAMA KOSUKE (JP)
OHKODA YOHEI (JP)
TANAKA KAHO (JP)
Application Number:
PCT/JP2021/034824
Publication Date:
March 31, 2022
Filing Date:
September 22, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B5/26; B29C65/40; B32B7/12; C09J5/02; C09J201/00; D06H5/00; D06M10/02
Domestic Patent References:
| WO2018003459A1 | 2018-01-04 |
Foreign References:
| JP2011525564A | 2011-09-22 | |||
| JP2011523911A | 2011-08-25 | |||
| JPH05186948A | 1993-07-27 | |||
| JP2017186695A | 2017-10-12 | |||
| JPS60185862A | 1985-09-21 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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