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Title:
BONDED BODY, METHOD FOR MANUFACTURING BONDED BODY, AND METHOD FOR EVALUATING ORGANIC RESIDUES OF BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/037974
Kind Code:
A1
Abstract:
A bonded body (10) obtained by bonding a first member (11) to a second member (12) with a solder layer (13) therebetween, wherein when the bonded body (10) is immersed in isopropanol to extract organic residues contained in the bonded body (10), the UV absorption spectrum of an extract having the extracted organic residues is measured, and the obtained UV absorption spectrum is standardized such that the absorbance at a wavelength of 207 nm is set as 100, the absorbance at a wavelength of 300 nm as obtained from the standardized UV absorption spectrum is at most 4.

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Inventors:
FEI SHUJIE (JP)
YASOSHIMA TSUKASA (JP)
HIROSE KAZUKI (JP)
Application Number:
PCT/JP2022/033100
Publication Date:
March 16, 2023
Filing Date:
September 02, 2022
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L21/52; G01N21/33
Domestic Patent References:
WO2019022193A12019-01-31
WO2020153418A12020-07-30
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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