BONDED STRUCTURE, METHOD FOR PRODUCING SAME, AND HEAT EXCHANGER

WIPO Patent Application WO/2020/017193

A1

A bonded structure (1) according to the present invention comprises: a first member (11) to be bonded, which has a first bonding surface (110); a second member (12) to be bonded, which has a second bonding surface (120); and a bonding resin layer (13) which is arranged between the first bonding surface (110) and the second bonding surface (120), and which contains a polymer (130). The polymer (130) in the bonding resin layer (13) has a polymer main chain (130A) which is oriented in an intersecting direction (X) that intersects with the first bonding surface (110) and the second bonding surface (120). It is preferable that the intersecting direction (X) extends along the thickness direction (T) of the bonding resin layer (13). A heat exchanger (2) according to the present invention comprises the bonded structure (1) wherein the first member (11) to be bonded is a tubular member (21) and the second member (12) to be bonded is a heat dissipation fin (22).

SAITO MASAMI (JP)
KONDO KOJI (JP)
TOTOKAWA MASASHI (JP)
MIYANO HIROTAKA (JP)
SUGANUMA YOSHITAKE (JP)
YAGI KENICHI (JP)
KATO YUICHI (JP)
MORI KUNIO (JP)
MORI KATSUHITO (JP)
HANDA TAIGA (JP)

PCT/JP2019/023239

January 23, 2020

June 12, 2019

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DENSO CORP (JP)

B32B7/12; F28F1/32; F28F21/04; F28F21/06; F28F21/08; H01L23/36; H05K7/20

WO2013065856A1	2013-05-10
WO2016076264A1	2016-05-19
WO2012043631A1	2012-04-05

JP2007154003A	2007-06-21
JP2013209542A	2013-10-10
JPS63264828A	1988-11-01
JP2004043629A	2004-02-12
JP2013155370A	2013-08-15
JP2018037640A	2018-03-08
JP2018037639A	2018-03-08
JP2013191297A	2013-09-26

AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)

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