Title:
BONDING APPARATUS AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/158664
Kind Code:
A1
Abstract:
A bonding apparatus 1 bonds a thin-membrane-shaped film F to a workpiece W, and is provided with a box body B for gripping the film F inside the box body B, a lower vacuum chamber 32 and an upper vacuum chamber 22 demarcated by the film F inside the box body B, an air pressure adjustment device 5 for adjusting the air pressure inside the vacuum chambers 22, 32, a movement mechanism 6 for moving the workpiece W inside the lower vacuum chamber 32, and a control device 7 for controlling the air pressure adjustment device 5 and the movement mechanism 6. The control device 7 reduces the pressure inside the vacuum chambers 22, 32 to a predetermined air pressure lower than atmospheric pressure, then increases the pressure inside the upper vacuum chamber 22 to a second air pressure higher than the first air pressure and lower than atmospheric pressure in a state in which the film F and the workpiece W are brought into contact, and then increases the pressure inside the vacuum chambers 22, 32 to atmospheric pressure.
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Inventors:
NAKAGAWA DAISUKE (JP)
MIYAMOTO KAZUKI (JP)
MIYAMOTO KAZUKI (JP)
Application Number:
PCT/JP2020/002767
Publication Date:
August 06, 2020
Filing Date:
January 27, 2020
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B29C51/12; B29C63/02
Foreign References:
| JP2013028065A | 2013-02-07 | |||
| US20150305448A1 | 2015-10-29 | |||
| JPH02139222A | 1990-05-29 | |||
| JP2018024119A | 2018-02-15 | |||
| US20130105077A1 | 2013-05-02 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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