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Title:
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
Document Type and Number:
WIPO Patent Application WO/2021/235269
Kind Code:
A1
Abstract:
A bonding device 1 comprises a chip holding part 101 that disposes a chip part 202 onto a substrate 201 that has been placed on a substrate stage 204. The bonding device 1 adjusts the inclination of a chip holding surface 101a that releasably holds the chip part 202. The bonding device 1 comprises: an adjustment controller 20 which stores inclination information pertaining to inclination respectively for locations on a stage main surface 204a having the substrate 201 placed thereon; and a conforming jig 10 which has a conforming surface 13a onto which the chip holding surface 101a is pressed, and in which the inclination of the conforming surface 13a can be changed such that the inclination of the chip holding surface 101a corresponds to the inclination indicated by the inclination information.

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Inventors:
ALEXANDER DZHANGIROV (JP)
NOGUCHI YUICHIRO (JP)
Application Number:
PCT/JP2021/017854
Publication Date:
November 25, 2021
Filing Date:
May 11, 2021
Export Citation:
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Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60
Domestic Patent References:
WO2015107715A12015-07-23
Foreign References:
JP2010027728A2010-02-04
JP2012094912A2012-05-17
JP2002359263A2002-12-13
US20100122456A12010-05-20
JP2006253384A2006-09-21
JP2010245370A2010-10-28
JP2014168089A2014-09-11
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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