Title:
BONDING METHOD AND METHOD FOR PRODUCING HETEROGENEOUS MATERIAL BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/057232
Kind Code:
A1
Abstract:
A bonding method for bonding a first frame member (11) and a second frame member (12) comprises: a projection formation step wherein a projection (13c) is formed by pressing in a predetermined region of a plate (13); a lamination step wherein flanges (11b, 12b) and the plate (13) are laminated such that the front end of the projection (13c) of the plate (13) is in contact with a flange (11b) and such that a flange (12b) is arranged between the flange (11b) and the plate (13); and a welding step wherein the projection (13c) is welded to the flange (11b) by sandwiching the laminate with a pair of electrodes (121, 122) such that the projection (13c) is pressed against the flange (11b) and by supplying a welding current between the pair of electrodes (121, 122).
Inventors:
KATSUMA HIDETO
IWAYA JIRO
NAITOU JUNYA
MAEDA YASUHIRO
HASHIMURA TORU
YUKISHIGE RYOHEI
IWAYA JIRO
NAITOU JUNYA
MAEDA YASUHIRO
HASHIMURA TORU
YUKISHIGE RYOHEI
Application Number:
PCT/JP2016/078182
Publication Date:
April 06, 2017
Filing Date:
September 26, 2016
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
International Classes:
B23K11/11; B21D47/04; B23K11/20; B62D21/00
Foreign References:
| JP2015066570A | 2015-04-13 | |||
| JP2012218018A | 2012-11-12 | |||
| JP2010131655A | 2010-06-17 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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