Title:
BONDING SHEET
Document Type and Number:
WIPO Patent Application WO/2021/182327
Kind Code:
A1
Abstract:
A bonding sheet (X) according to the present invention contains a matrix resin, a plurality of solder particles, and a plurality of flux particles, and has a sheet thickness T. In the bonding sheet (X), the particle diameter D50 of the solder particles is at most 12 μm, the particle diameter D50 of the flux particles is at most 30 μm, and the ratio of the particle diameter D90 of the solder particles and the particle diameter D90 of the flux particles to the sheet thickness T is at most 0.95.
Inventors:
TANAKA AKIKO (JP)
SHISHIDO YUICHIRO (JP)
NISHIMARU AYUMI (JP)
SHISHIDO YUICHIRO (JP)
NISHIMARU AYUMI (JP)
Application Number:
PCT/JP2021/008686
Publication Date:
September 16, 2021
Filing Date:
March 05, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J9/02; C09J7/10; C09J7/35; C09J11/04; C09J11/06; C09J201/00; H01L21/60; H05K3/34
Domestic Patent References:
| WO2016031554A1 | 2016-03-03 |
Foreign References:
| JP2014013879A | 2014-01-23 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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