BONDING SYSTEM AND METHOD FOR INSPECTING MULTILAYER SUBSTRATE

WIPO Patent Application WO/2021/070661

A1

A bonding system (1) according to the present invention comprises a bonding device (41), an inspection device (80), and a control unit (70). The bonding device forms a multilayer substrate (T) by bonding a first substrate (W1) and a second substrate (W2). The inspection device inspects the multilayer substrate. The control unit controls the inspection device. The control unit includes a measurement control unit (71a), a comparison unit (71c), and a remeasurement control unit (71e). The measurement control unit causes the inspection device to measure the multilayer substrate at a first number of measurement points. The comparison unit compares, with a reference (72b), an inspection result (72a) that includes an amount of displacement between the first substrate and the second substrate of the multilayer substrate derived from the measurement result. The remeasurement control unit causes the inspection device to remeasure the multilayer substrate at a second number of measurement points that is greater than the first number of measurement points on the basis of the comparison result from the comparison unit.

OTSUKA YOSHITAKA (JP)
TSURUTA SHIGETO (JP)
MIMURA YUJI (JP)
MAEDA HIROSHI (JP)
MANABE EIJI (JP)
HIZUME HISANORI (JP)
SHINOZUKA SHINICHI (JP)
TANOUE HIRONORI (JP)

PCT/JP2020/036623

April 15, 2021

September 28, 2020

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TOKYO ELECTRON LTD (JP)

H01L21/02; H01L21/66

WO2019146427A1	2019-08-01
WO2019087707A1	2019-05-09

JP2011066287A	2011-03-31
JP2015119088A	2015-06-25
JPH06112295A	1994-04-22

SAKAI INTERNATIONAL PATENT OFFICE (JP)

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