Title:
BONDING SYSTEM, BONDING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/176798
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of providing a bonding system, a bonding method, and a method for manufacturing a semiconductor device that are capable of enhancing the reliability of bonding. A bonding system (1) is provided with: a first holding part (21); a second holding part (22); and a cleaning device (3). The first holding part (21) holds a first bonding object (D1). The second holding part (22) holds a second bonding object (D2). The cleaning device (3) performs cleaning processing for irradiating a first bonding surface (D1a) of the first bonding object (D1) held on the first holding part (21) with a first laser beam (L1) and irradiating a second bonding surface (D2a) of the second bonding object (D2) held on the second holding part (22) with a second laser beam (L2).
Inventors:
YAGI YOSHIHIKO
KISHI ARATA
YOSHIDA TAKAYUKI
KISHI ARATA
YOSHIDA TAKAYUKI
Application Number:
PCT/JP2022/005601
Publication Date:
August 25, 2022
Filing Date:
February 14, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L21/02; H01L21/304; H01L21/52
Foreign References:
| JP2004006707A | 2004-01-08 | |||
| JP2004200330A | 2004-07-15 | |||
| JP2005252176A | 2005-09-15 | |||
| JP2004103991A | 2004-04-02 | |||
| JP2013506311A | 2013-02-21 | |||
| JP2002064042A | 2002-02-28 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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