Title:
BULK ACOUSTIC RESONATOR AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/125308
Kind Code:
A1
Abstract:
A bulk acoustic resonator and a preparation method therefor. The preparation method comprises: providing a first silicon wafer, and preparing, on the first silicon wafer, a cavity having an opening at the top; providing a second silicon wafer, preparing an insulating layer on the upper surface of the second silicon wafer, and preparing a resonant piezoelectric stack on the upper surface of the insulating layer, the resonant piezoelectric stack comprising a piezoelectric film, and a first electrode and a second electrode which are respectively in contact with the piezoelectric film and are independent of each other; preparing a first silicon dioxide layer on the upper surface of the resonant piezoelectric stack, the upper surface of the resonant piezoelectric stack comprising one or more of the surface of the piezoelectric film, the surface of the first electrode, and the surface of the second electrode; bonding the surface where the opening of the cavity is located with the upper surface of the first silicon dioxide layer; and preparing lead-out bonding pads of the first electrode and the second electrode.
Inventors:
LV PING (CN)
LI GANG (CN)
HU WEI (CN)
LI GANG (CN)
HU WEI (CN)
Application Number:
PCT/CN2019/119746
Publication Date:
June 25, 2020
Filing Date:
November 20, 2019
Export Citation:
Assignee:
MEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD (CN)
International Classes:
H03H3/02
Foreign References:
| CN109831172A | 2019-05-31 | |||
| CN107093994A | 2017-08-25 | |||
| CN108362408A | 2018-08-03 | |||
| CN105784189A | 2016-07-20 | |||
| CN101692602A | 2010-04-07 | |||
| CN107222181A | 2017-09-29 |
Attorney, Agent or Firm:
BEIJING BRIGHT IP AGENCY CO., LTD. (CN)
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