Title:
BURN-IN TESTING APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO2005084328
Kind Code:
A3
Abstract:
An integrated circuit (IC) package testing apparatus (Figure 5) integrates a temperature sensor (48), heater (or cooler) (44), and controller (42) within a single modular unit (22). The controller is a microprocessor embedded within the modular unit in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket.
Inventors:
LOPEZ CHRISTOPHER A (US)
DENHEYER BRIAN J (US)
KUENSTER GORDON B (US)
DENHEYER BRIAN J (US)
KUENSTER GORDON B (US)
Application Number:
PCT/US2005/006724
Publication Date:
December 22, 2005
Filing Date:
February 28, 2005
Export Citation:
Assignee:
WELLS CTI LLC (US)
LOPEZ CHRISTOPHER A (US)
DENHEYER BRIAN J (US)
KUENSTER GORDON B (US)
LOPEZ CHRISTOPHER A (US)
DENHEYER BRIAN J (US)
KUENSTER GORDON B (US)
International Classes:
G01K1/02; G01K1/16; G01R1/04; G01R31/02; (IPC1-7): G01R31/02; G01K1/02
Foreign References:
| US5164661A | 1992-11-17 | |||
| US6477047B1 | 2002-11-05 | |||
| US6362640B1 | 2002-03-26 |
Other References:
"tekmar-Data Brochure, 10K Sensors.", D070, TEKMAR CONTROL SYSTEMS LTD., November 2001 (2001-11-01), pages 1 - 4, XP002993065
See also references of EP 1723438A4
See also references of EP 1723438A4
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