ELECTRICAL INTERCONNECTS

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority from U.S. Patent Application No.

15/682,456, filed on August 21, 2017, and further claims the benefit of U.S.

Provisional Patent Application No. 62/378,001, filed on August 22, 2016, each of which is hereby incorporated by reference in their entirety.

FIELD

[0002] The invention relates generally to camera lens suspensions such as those incorporated into mobile devices such as phones and tablets. In particular, the invention relates to such suspensions that include an auto focus system.

BACKGROUND

[0003] Camera lens optical image stabilization (OIS) assemblies are generally known and disclosed, for example, in the Miller U.S. Patent 9,366,879 and the Ladwig U.S. Patent Application Publication 2016/0154251, both of which are incorporated herein by reference in their entireties and for all purposes.

Embodiments include a moving member mounted to a support member. A base can be mounted to the side of the support member opposite the moving member. OIS assemblies of these types can have a lens holder with an auto focus (AF) assembly or system mounted thereto (e.g., to the moving member). Electrical connections to the AF system are made by electrically connecting (e.g., solder or conductive adhesive) terminal pads on the AF assembly to terminal pads on the OIS assembly. In embodiments such as those shown in the Miller patent, Ladwig publication, and FIG. 1 herein, the terminal pads on the AF assembly are at locations above the lowermost portion or base of the assembly, and the terminal pads 102 on the OIS assembly 101 are on pads or "gooseneck" forms that are above the major planar surface of the moving member. The location of the AF electrical connection between the OIS and AF assemblies is thereby over the shape memory alloy (SMA) wires of the OIS assembly, while still being accessible from the outside to enable the lens holder builder to make the electrical connections.

SUMMARY

[0004] A camera lens assembly is described. The camera lens assembly includes a support member. The camera lens assembly also includes a moving member having a major planar surface and AF terminal pads located at or near the major planar surface, wherein the moving member is mounted to the support member. And, the camera lens assembly includes an auto focus assembly having

AF terminal pads, wherein the auto focus assembly is mounted to the moving member and the AF terminal pads of the auto focus assembly are electrically connected to the AF terminal pads of the moving member. [0005] Other features and advantages of embodiments of the present invention will be apparent from the accompanying drawings and from the detailed description that follows.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Embodiments of the present invention are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements and in which:

[0007] Figure 1 illustrates several views of an optical image stabilization assembly including a terminal pad on a gooseneck form;

[0008] Figures 2A-B illustrate an OIS assembly including terminal pads according to an embodiment;

[0009] Figure 3 illustrates an OIS moving member terminals according to an embodiment;

[0010] Figure 4 illustrates an OIS assembly including terminal pads according to another embodiment;

[0011] Figure 5 illustrates an embodiment having OIS moving member AF terminals according to an embodiment;

[0012] Figure 6 illustrates a terminal pad according to an embodiment; and

[0013] Figure 7 illustrates a terminal pad according to another embodiment. DETAILED DESCRIPTION

[0014] Embodiments of the invention include OIS and AF assemblies having OIS-AF electrical interconnect structures that are located at or near the major planar surface of the OIS moving member. The interconnect structures include AF terminal pads on the OIS and AF assemblies that are electrically connected by, e.g., solder or conductive adhesive.

[0015] FIGs. 2A and 2B illustrate an embodiment where the terminal pads on the AF assembly and the OIS assembly are located at or adjacent the plane of the plate of the OIS moving member, near the inner diameter (ID) of the plate and at a location on the plate that is not covered by the OIS assembly base or the base (e.g., stainless steel) layer of the support member. As shown, the stainless steel layer 202 that is a major planar surface of the moving member 218 and polyimide/insulating layers 204 of the moving member 218 have openings that provide bottom-side or back-side access to the terminal pad 206 on the moving member 218. The terminal pad 206 on the moving member 218, which is formed from the conductor layer, has an opening 208 defined by an edge that also provides access to the terminal pad 210 on the AF assembly 212. In the illustrated embodiment, the terminal pad 206 on the moving member 218 is "horseshoe" shaped to locate at least a portion of the moving member terminal 206 adjacent to the AF assembly terminal 210, and in a co-planar relationship. Thus, the terminal pad 206 of the moving member 218 are located at or near the major planar surface of the moving member 218. For an embodiment, the terminal pad 206 has a portion that extends beyond the insulating layer of the moving member 218 and which can have an edge defining an aperture through a conductive material layer.

[0016] In other embodiments (not shown) the terminal pad of the OIS assembly can have a through hole that is surrounded by the conductive material of the terminal pad, and that is located over the terminal pad of the AF assembly. The terminal pads 206 on the moving member 218 can be coupled to traces as shown in the Miller patent and Ladwig publication. The terminal pads of the OIS and AF assemblies are electrically connected by solder or conductive adhesive 214 that can be applied from the bottom side of the OIS assembly (i.e., from the side opposite the moving member of the AF assembly, and through the OIS base 216 and the base layer of the support member). The mass of solder or conductive adhesive 214 will overlap onto both the moving member terminal pads 206 and AF terminal pads 210.

[0017] FIG. 3 illustrates an embodiment having OIS moving member terminals that are structurally similar to those shown in the embodiment of FIGs. 2 A and 2B. In the FIG. 3 embodiment, the terminal pads 306 on the OIS moving member 306 are located adjacent to one another, and at a location that is outwardly spaced from the inner diameters of the OIS base 316, the OIS support member 308 and the OIS moving member 306. The terminal pads of the AF assembly will also be located adjacent one other. The OIS base 316, the stainless steel layers 302 of the OIS support member and of the OIS moving member, and the polyimide insulating layer 318 of the OIS moving member, have openings 322 to provide bottom-side access to the terminal pads 310 on the OIS moving member 306 and AF assembly. Further, an opening 320 in the OIS base 316 and stainless steel layer 302 of OIS support member 308 provide access to the terminal pads 310 and openings 322. The terminal pads on the OIS moving member and AF assembly are located with respect to one another, and can be interconnected, in a manner similar to that described above in connection with the FIGs. 2A and 2B embodiments.

[0018] FIG. 4 illustrates another embodiment, where the terminal pads on the AF assembly and the OIS assembly are located at or adjacent the plane of the plate of the OIS moving member, near the inner diameter (ID) of the plate and at a location on the plate that is not covered by the OIS assembly base 416 or the base (e.g., stainless steel) layer of the support member 402. As shown, the OIS moving member AF terminal pads 410 are located over a portion of the moving member stainless steel layer 424 (with the poly layer 418 located between the terminal pads 410 and the stainless steel layer 424). In the illustrated

embodiment, the OIS moving member terminal pads 410 are located over stainless steel islands 426. In other embodiments (not shown), the OIS moving member terminal pads are located over non-isolated portions of moving member stainless steel layer. Plated solder can be located on the moving member terminal pads 410. The terminal pads 406 of the AF assembly 430 are located on the assembly at locations that contact the moving member terminal pads 410 when the AF assembly 430 is mounted to the OIS assembly 432. The bottom side access to the stainless steel portions 424 of the moving member 404 opposite the moving member terminal pads 410 enables a heated tip 440 to contact the stainless steel layer, and thereby heat and reflow the solder on the moving member terminal pads 410 to electrically connect the moving member 404 and AF terminal pads 406. In other embodiments, the moving member terminals 410 and AF terminals 406 can be structurally and electrically connected by conductive adhesive. The terminal pads 410 on the moving member 404 can be coupled to traces using techniques know in the art, for example using techniques as shown in the Miller patent and Ladwig publication. According to an embodiment, to aid in heat flow of a heated tip 440 to reflow solder, the AF terminal pad 406 is electrically connected to the spring metal island 426 directly underneath it, which the heated tip 440 contacts. This can provide a maximum speed of heat transfer to the solder.

[0019] FIG. 5 illustrates an embodiment having OIS moving member AF terminals that are structurally similar to those shown in the embodiment of FIG. 4. In the FIG. 5 embodiment, the terminal pads 510 of the OIS moving member 504 are at a location that is outwardly spaced from the inner diameters of the OIS base, the OIS support member 508 and the plate of the OIS moving member 504. The terminal pads 510 on the OIS moving member 504 and terminal pads 506 on the AF assembly 530 are located with respect to one another, and can be interconnected, in a manner similar to that described above in connection with the FIG. 4 embodiment.

[0020] Figure 6 illustrates a terminal pad according to an embodiment. The terminal pad 610 is formed in a "horseshoe" shape and may be located on the inner diameter of an OIS moving member such as described herein. The terminal pad 610 includes an inner stainless steel horseshoe 602 isolated from the stainless steel layer 604. For an embodiment, the stainless steel layer is etched to form a void having a horseshoe shape in the stainless steel layer and forming an inner stainless steel horseshoe 602 using techniques including those known in the art.

[0021] The terminal pad 610 includes a conductive pad 606 formed on the stainless steel layer 604 and extending beyond the stainless steel layer 604 into the horseshoe void formed in the stainless steel layer 604 and the inner stainless steel horseshoe 602. For an embodiment, the conductive pad 606 defines a void 603. The conductive pad 606 is coupled with a conductive trace 608. The conductive pad 606 and conductive trace 608 may be part of a conductive layer of an OIS moving member. For some embodiments, the conductive trace 606 is copper. One skilled in the art would understand that other conductive materials may be used.

[0022] The terminal pad 610, according to some embodiments, includes a gold plated portion 612 of the conductive pad 606. The conductive pad 606 is configured to contact with another terminal pad, such as a terminal pad of an AF assembly as described herein. According to an embodiment, the inner stainless steel horseshoe 602 is configured to act as a dam to stop any inadvertent solder or conductive epoxy from causing a short circuit between an AF terminal pad and a stainless steel layer 604, for example a plate metal of a moving member. Thus, the inner stainless steel horseshoe 602 makes manufacturing an electrical connection easier and more reliable.

[0023] Figure 7 illustrates a terminal pad according to another embodiment.

The terminal pad 710 is formed in a "horseshoe" shape and may be located on the inner diameter of an OIS moving member such as described herein. The terminal pad 710 includes an inner stainless steel horseshoe 702 isolated from the stainless steel layer 704. For an embodiment, the stainless steel layer 704 is etched to form a void having a horseshoe shape in the stainless steel layer 704 and forming an inner stainless steel horseshoe 702 using techniques including those known in the art. The inner stainless steel horseshoe 702 includes a pad portion

705 that is configured to have a lower height than the rest of the inner stainless steel horseshoe 702. The pad portion 705 is configured to receive another terminal pad to make an electrical connection between the two terminal pads, for example, a terminal pad of an AF assembly.

[0024] The terminal pad 710 includes a conductive pad 706 formed on the stainless steel layer 704 and extending beyond the stainless steel layer 704 into the horseshoe void formed in the stainless steel layer 704. The conductive pad

706 is coupled with a conductive trace 708. According to an embodiment, the conductive pad 706 is electrically coupled with the inner stainless steel horseshoe 702 but does not extend beyond the inner horseshoe void 703 formed in the inner stainless steel horseshoe 702. The conductive pad 706 and conductive trace 708 may be part of a conductive layer of an OIS moving member. For some embodiments, the conductive trace 706 is copper. One skilled in the art would understand that other conductive materials may be used.

[0025] The terminal pad 710, according to some embodiments, includes a gold plated portion 712 of the inner stainless steel horseshoe 702 including the pad portion 705 of the inner stainless steel horseshoe 702. The conductive pad 706 is configured to contact with another terminal pad, such as a terminal pad of an AF assembly as described herein. According to an embodiment, the pad portion 705 is configured to act as a dam to stop any inadvertent solder or conductive epoxy from causing a short circuit between an AF terminal pad and a stainless steel layer 604, for example a plate metal of a moving member. Thus, the inner stainless steel horseshoe 602 makes manufacturing an electrical connection easier and more reliable.

[0026] Embodiments of the invention offer important advantages. For example, they can minimize the impact of OIS AF connection on the design of the

AF assembly. They can alleviate issues associated with the formed up AF gooseneck pads such as those of the prior art that require clearances in the AF assembly bottom that can lead to a thicker AF assembly and limit the Z-stroke of the AF assembly. They make room for the AF bottom spring to be placed lower in the AF base, which can enable greater AF stroke. They can also alleviate issues associated with structural weakening and relatively low shock robustness presented by the gooseneck form.

[0027] In the foregoing specification, specific exemplary embodiments of the invention have been described. It will, however, be evident that various modifications and changes may be made thereto. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.