Title:
CAMERA MODULE INCLUDING PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2021/033921
Kind Code:
A1
Abstract:
A camera module according to various embodiments of the present disclosure comprises: an image sensor; and a printed circuit board structure electrically connected to the image sensor. The printed circuit board structure may comprise: a first layer disposed under the image sensor; a second layer disposed between the first layer and the image sensor; a first conductive pattern formed on the first layer and electrically connected to the image sensor through one end portion so as to transmit a signal obtained from the image sensor to an external electronic component; and a first open space formed in the second layer such that the one end portion of the first conductive pattern is exposed to the surface of the printed circuit board structure.
Inventors:
LEE GWANYONG (KR)
HWANG CHEOL (KR)
HWANG CHEOL (KR)
Application Number:
PCT/KR2020/009043
Publication Date:
February 25, 2021
Filing Date:
July 09, 2020
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04N5/225; H05K1/18; H05K3/46
Foreign References:
| KR20130040425A | 2013-04-24 | |||
| JP2002111221A | 2002-04-12 | |||
| KR20190021118A | 2019-03-05 | |||
| KR20070054304A | 2007-05-29 | |||
| KR20070096303A | 2007-10-02 |
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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