CAPACITOR-FORMING SYSTEM AND CAPACITOR-FORMING METHOD

Title:

CAPACITOR-FORMING SYSTEM AND CAPACITOR-FORMING METHOD

Document Type and Number:

WIPO Patent Application WO/2021/015019

Kind Code:

A1

Abstract:

Provided are a capacitor-forming system and capacitor-forming method for increasing surface area.　The capacitor-forming system comprises: a lower electrode-forming device for forming a lower electrode on a substrate; a dielectric film-forming device for forming a dielectric film on the substrate; an upper electrode-forming device for forming an upper electrode on the substrate; and a modifying device for radiating a laser onto at least one of the lower electrode and the dielectric film, wherein a capacitor having the lower electrode, the dielectric layer, and the upper electrode is formed.

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Inventors:

MURAKAMI SEISHI (JP)

Application Number:

PCT/JP2020/027131

Publication Date:

January 28, 2021

Filing Date:

July 10, 2020

Export Citation:

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Assignee:

TOKYO ELECTRON LTD (JP)

International Classes:

H01L27/04; C23C16/56; H01G4/30; H01G4/33

Domestic Patent References:

WO2013035561A1

2013-03-14

Foreign References:

JP2002164514A	2002-06-07
JPH04335568A	1992-11-24
JP2005194540A	2005-07-21

Attorney, Agent or Firm:

ITOH, Tadashige et al. (JP)

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