Title:
CAPACITOR LAYER FORMING BOTH−SIDE COPPER−CLAD LAMINATED HEET AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2003/011589
Kind Code:
A1
Abstract:
A capacitor layer forming both−side copper−clad laminated sheet which delivers an excellent withstand voltage performance without short−circuiting even when voltage is applied between copper foil surfaces, and is provided with an insulation layer not broken by a showering pressure at etching, and which has a layer structure comprising copper foil layers as conductors disposed on the outer layers on the opposite surfaces, and a resin layer as a dielectric held between a copper foil layer on one surface side and a copper foil layer on the other surface side, characterized in that the resin layer has a three−layer structure consisting of thermosetting resin layer&sol heat−resisting film layer&sol thermosetting resin layer and has a total thickness of up to 25 μm, the thermosetting resin layer is formed of an epoxy resin material, and the heat resisting film layer consists of a resin material having normal characteristics including a Young modulus of at least 300 kg&sol mm2, a tensile strength of at least 20 kg&sol mm2 and a tensile elongation of at least 5%, having a softening temperature higher than the molding temperature of thermosetting resin forming thermosetting resin layers on the opposite surfaces, and having a relative permittivity of at least 2.5&semi and a production method therefor.
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Inventors:
KUWAKO FUJIO
YAMAZAKI KAZUHIRO
MATSUSHIMA TOSHIFUMI
YAMAZAKI KAZUHIRO
MATSUSHIMA TOSHIFUMI
Application Number:
PCT/JP2002/007600
Publication Date:
February 13, 2003
Filing Date:
July 26, 2002
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B15/08; H01G4/18; H05K1/03; H05K1/16; H05K3/00; H05K3/38; (IPC1-7): B32B15/08; H01G4/18; H05K1/16
Foreign References:
| JPH11340078A | 1999-12-10 | |||
| JP2000043211A | 2000-02-15 | |||
| JPH08120098A | 1996-05-14 | |||
| JPH02168694A | 1990-06-28 | |||
| JPH08197681A | 1996-08-06 |
Other References:
See also references of EP 1422055A4
Attorney, Agent or Firm:
Tanaka, Daisuke (15-2 Hongo 1-chome Bunkyo-ku, Tokyo, JP)
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