Title:
CARRIER FOR DOUBLE-SIDED POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/163721
Kind Code:
A1
Abstract:
The present invention relates to a carrier for a double-sided polishing device, the carrier having: a carrier base material in which a holding hole for holding a wafer during polishing is formed; and an insert material disposed along the inner circumference of the holding hole. In the carrier base material, an uneven part is periodically formed along the inner circumference of the holding hole, the distance between the centers of recess portions adjacent to each other in the uneven part is 10 mm to 60 mm, and the area of a protruding portion of the uneven part is larger than the area of a notch portion of the recess part. In the insert material, an uneven part, which can be fitted with the uneven part formed on the inner circumference of the holding hole, is periodically formed on the outer circumference of the insert material, and the uneven part formed on the inner circumference of the holding hole of the carrier base material is fitted with the uneven part formed on the outer circumference of the insert material. Thus, the carrier for the double-sided polishing device, in which deformation of a peripheral portion (fitting portion) of the holding hole in the carrier base material is reduced, is provided.
Inventors:
KITAZUME DAICHI (JP)
TANAKA YUKI (JP)
TANAKA YUKI (JP)
Application Number:
PCT/JP2018/004856
Publication Date:
September 13, 2018
Filing Date:
February 13, 2018
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/28; H01L21/304
Foreign References:
| JP2002018708A | 2002-01-22 | |||
| JP2009012086A | 2009-01-22 | |||
| JP2011067918A | 2011-04-07 | |||
| JP2013502719A | 2013-01-24 | |||
| JP2004122346A | 2004-04-22 | |||
| JP2010280026A | 2010-12-16 | |||
| JPH10329013A | 1998-12-15 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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